1
Osamu Shiono, Takao Ishikawa, Takashi Namekawa, Yasutaka Suzuki, Takashi Naito, Hiroki Yamamoto, Daigoro Kamoto, Ken Takahashi, Tadanori Segawa, Toshiya Sato, Takao Miwa, Shigehisa Motowaki: Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate. Renesas Technology, Dickstein Shapiro, February 27, 2007: US07183650 (20 worldwide citation)

A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon a ...


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Osamu Shiono, Takao Ishikawa, Takashi Namekawa, Yasutaka Suzuki, Takashi Naito, Hiroki Yamamoto, Daigorou Kamoto, Ken Takahashi, Tadanori Segawa, Toshiya Satoh, Takao Miwa, Shigehisa Motowaki: Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate. Renesas Technology, Dickstein Shapiro, May 19, 2009: US07535106

A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon a ...


3
Osamu Shiono, Takao Ishikawa, Takashi Namekawa, Yasutaka Suzuki, Takashi Naito, Hiroki Yamamoto, Daigoro Kamoto, Ken Takahashi, Tadanori Segawa, Toshiya Sato, Takao Miwa, Shigehisa Motowaki: Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate. Hitachi, Renesas Technology, Dickstein Shapiro, May 24, 2007: US20070114653-A1

A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon a ...