1
Masahiro Watabe: Dry process apparatus using plural kinds of gas. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, March 19, 1996: US05500256 (107 worldwide citation)

An apparatus for manufacturing a semiconductor device including: a process chamber capable of being evacuated; a wafer susceptor disposed in the process chamber, the wafer susceptor having a plane on which a wafer to be processed is placed; a plurality of gas flow paths forming a structure of a plur ...


2
Tadahiro Ohmi: Wafer susceptor. Oblon Spivak McClelland Maier & Neustadt, January 30, 1990: US04897171 (58 worldwide citation)

A wafer susceptor is disclosed. The wafer susceptor has: a first conductive electrode which includes its flat surface covered with a thin insulating film; a second conductive electrode which is electrically insulated from the first conductive electrode and is disposed so that the surface thereof is ...


3
Derrick W Foster, Cornelius A van der Jeugd, John F Wengert: Low-mass susceptor. ASM America, Knobbe Martens Olson & Bear, July 11, 2000: US06086680 (30 worldwide citation)

A wafer susceptor for semiconductor processing devices, having a thermal mass which is close to that of the wafer. The similarity between the thermal masses of the susceptor and wafer enables a higher throughput and reduces temperature uniformities across the wafer. The low-mass susceptor may be mad ...


4
Tadahiro Ohmi, Masaru Umeda: Apparatus for forming film with surface reaction. OHMI Tadahiro, Jeffers Hoffman & Niewyk, December 18, 1990: US04977855 (10 worldwide citation)

An apparatus for forming a high quality film at high speed includes a wafer susceptor provided wiht a vacuum exhaust system, a stock gas supply system, and a heating mechanism for directly heating the susceptor. A ceramic filter means is disposed in opposite juxtaposed face to face position relative ...


5
Raymond Joe, Anthony Dip: Removable semiconductor wafer susceptor. Tokyo Electron, Smith Gambrell & Russell, October 5, 2004: US06799940 (9 worldwide citation)

A removable semiconductor wafer susceptor used for supporting a substrate during batch processing. The susceptor includes a flat circular central plane with a predetermined outer diameter. The susceptor is sized to fit within an inner diameter formed from wafer support ledges of a wafer transport co ...


6
Anthony Dip, Takanori Saito, Raymond Joe: Semiconductor wafer susceptor. Tokyo Electron, Smith Gambrell & Russell, April 4, 2006: US07022192 (7 worldwide citation)

A semiconductor wafer susceptor for batch substrate processing. The susceptor includes a central region in a primary plane and a plurality of flat annular extensions extending below the central region in a secondary plane. The primary and secondary planes are parallel to each other. An edge of the s ...


7
Yuri Nikolaevich Tolmachev, Dong joon Ma, Chang wook Moon, Hea young Yoon: Inductively coupled plasma system. Samsung Electronics, Lee & Sterba P C, December 28, 2004: US06835919 (6 worldwide citation)

An inductively coupled plasma apparatus is provided, wherein the inductively coupled plasma apparatus includes a process chamber having a wafer susceptor on which a substrate is installed, a top plasma source chamber which is installed on the process chamber, a reactor, which is installed in the top ...


8
Yamaguchi Shinji: Susceptor for semiconductor manufacturing apparatus. NGK Insulators, May 10, 2002: JP2002-134590 (3 worldwide citation)

PROBLEM TO BE SOLVED: To prevent dislocation of a wafer caused by suction to a wafer susceptor placing plane when the wafer is supported on the susceptor and treated under heat and then the supporting of it is released.SOLUTION: A susceptor 1 comprises a surface layer 3 to which a placement surface ...


9
Tokaji Hiroyuki: Wafer carrier. Sumitomo Mitsubishi Silicon, June 20, 2003: JP2003-174069 (1 worldwide citation)

PROBLEM TO BE SOLVED: To shorten the working time of inch conversion work for implanting ions into wafers having different outside diameter by eliminating the work for replacing an arm wafer receiver.SOLUTION: First arm wafer receivers 26 and 27 are provided, respectively, with a plurality of carry- ...


10
Tolmachev Yuri Nikolaevich, Ma Dong Joon, Moon Chang Wook, Yoon Hea Young: Induction coupled plasma system. Samsung Electronics, September 5, 2003: JP2003-249493 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide an induction coupled plasma system.SOLUTION: The induction coupled plasma system comprises a lower process chamber 2 being provided with a wafer susceptor, an upper plasma source chamber 1 mounted on the lower process chamber 2, a reactor 3 disposed in the upper plas ...



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