1
Eric W Strid, Kimberly R Gleason: Wafer probe. Cascade Microtech, Dellett Smith Hill and Bedell, May 2, 1989: US04827211 (123 worldwide citation)

A wafer probe for accessing bonding pads on a planar device includes contact pads mounted on one edge of the under side of a dielectric substrate board and arranged to align with the bonding pads to be accessed. Coplanar ground and signal conductors deposited on the under side of the substrate board ...


2
Kimberly R Gleason, Eric W Strid, Robert T Flegal, Angus J McCamant: Wafer probes. TriQuint Semiconductor, John Smith Hill, William S Lovell, August 1, 1989: US04853627 (105 worldwide citation)

A wafer probe comprises a support member having an end region which is shaped to permit the end region to be brought into close proximity with a component under test. An amplifier is mounted on the support member at its end region. A conductive probe element is attached to the amplifier and is elect ...


3
Thomas W Bachelder, Dennis R Barringer, Dennis R Conti, James M Crafts, David L Gardell, Paul M Gaschke, Mark R Laforce, Charles H Perry, Roger R Schmidt, Joseph J Van Horn, Wade H White: Segmented architecture for wafer test and burn-in. International Business Machines Corporation, William N Hogg, Robert A Walsh, August 14, 2001: US06275051 (60 worldwide citation)

An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distribut ...


4
Gleason Reed, Strid Eric W, Flegal Robert T, Mccamant Angus J: Wafer probes.. Tektronix, August 5, 1987: EP0230766-A1 (37 worldwide citation)

A wafer probe comprises a support member having an end region which is shaped to permit the end region to be brought into close proximity with a component under test. An amplifier is mounted on the support member at its end region. A conductive probe element is attached to the amplifier and is elect ...


5
Scott V Johnson: High frequency wafer probe apparatus and method. Motorola, Kevin B Jackson, January 23, 1996: US05486770 (14 worldwide citation)

An apparatus for probing high frequency electronic devices in wafer form includes a high frequency wafer probe (16, 56) having a conductor (36, 61), a dielectric layer (37, 71, 72), a grounding layer (38, 81, 82, 91), a signal probe needle (39,86), and a pair of ground needles (43, 72, 76) coupled t ...


6
Horst Leuschner: Wafer keys for wafer probe alignment. SGS Semiconductor Corporation, M David Shapiro, July 5, 1988: US04755750 (9 worldwide citation)

The invention comprises a system of alignment key patterns, within the scribe lines of a semiconductor chip, which allow more accurate placement of wafer probes, and more accurate location of fuses for the purposes of blowing selected ones of those fuses by means of laser energy.


7
Scott V Johnson: High frequency stripline blade probe device and method of probing. Motorola, Kevin B Jackson, September 28, 1999: US05959460 (4 worldwide citation)

An apparatus for probing high frequency electronic devices in wafer form comprising a high frequency wafer probe (16,56) having a conductor (36,61), a dielectric layer (37,71,72), a grounding layer (38,81,82,91), a signal probe needle (39,86), and a pair of ground needles (43,72,76) coupled to a sub ...


8
Frederic Anthony Schraub, Michael R Vogtmann, Benjamin C Smedley: System and method for in situ monitoring of top wafer thickness in a stack of wafers. Strasbaugh, K David Crockett Esq, Crockett & Crockett PC, August 27, 2013: US08520222 (4 worldwide citation)

A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding.


9
Christos Tsironis: Method for planarity alignment of wafer probes. April 26, 2016: US09322843 (3 worldwide citation)

A “Theta” angle adjustment tool is made of a solid parallelepiped and adjusting screw, that allows the wafer probes to be fastened to the auxiliary equipment under correcting “Theta” angles. The procedure consists of loosening the probe and pressing hard on the tool to force the probe to adjust to t ...


10
Evan Grund: Test circuits and current pulse generator for simulating an electrostatic discharge. Donald L Bartels, Bartels Law Group, October 2, 2012: US08278936 (3 worldwide citation)

This invention is an electrostatic discharge testing circuit that can deliver current pulses to a component under test (CUT) with a custom amplitude versus time profile shape. Pulse generation with customized shapes is accomplished by discharging an energy storage network comprised of capacitor(s), ...