1
Larry R Lockwood, Kimberly R Gleason, Eric W Strid: Wafer probe. Cascade Microtech, Dellett Smith Hill & Bedell, September 29, 1987: US04697143 (193 worldwide citation)

A wafer probe is provided having metallic transmission lines mounted on a tapered alumina substrate generally surrounded by microwave absorbing material. The probe provides for on-wafer measurements of small planar devices at frequencies from DC to at least 18 GHz with low inductance, and with const ...


2
David R Hembree, Salman Akram: Semiconductor probe card having resistance measuring circuitry and method fabrication. Micron Technology, Stephen A Gratton, January 30, 2001: US06181144 (168 worldwide citation)

A probe card for testing semiconductor wafers, and a method for fabricating the probe card are provided. The probe card is adapted for use with a wafer probe handler, and a tester containing test circuitry. The probe card includes a substrate, and patterns of probe contacts formed on the substrate. ...


3
Jeremy Burr, Gregory Nordgren, Eric W Strid, Kimberly R Gleason: Coaxial wafer probe with tip shielding. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, October 15, 1996: US05565788 (140 worldwide citation)

A shielded microwave probe tip assembly includes an end of a coaxial cable coupled to probe fingers forming a coplanar controlled impedance microwave transmission line where the ground probe fingers are interconnected by a shield member that is spaced apart from the signal line probe finger but is p ...


4
K Reed Gleason, Keith E Jones, Eric W Strid: Microwave wafer probe having replaceable probe tip. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, July 18, 1989: US04849689 (128 worldwide citation)

A microwave wafer probe having a replaceable planar transmission line probe tip which detachably connects to a planar transmission line circuit board within the probe head. The circuit board may include passive and/or active electrical circuit components interconnecting its conductors which, due to ...


5
David R Hembree, Warren M Farnworth, Salman Akram, Alan G Wood, C Patrick Doherty, Andrew J Krivy: Probe card for semiconductor wafers and method and system for testing wafers. Micron Technology, Stephen A Gratton, May 9, 2000: US06060891 (124 worldwide citation)

A probe card for testing semiconductor wafers, and a method and system for testing wafers using the probe card are provided. The probe card is configured for use with a conventional testing apparatus, such as a wafer probe handler, in electrical communication with test circuitry. The probe card incl ...


6
Alvin M Kong, James C Lau, Steven S Chan: Mass simultaneous sealing and electrical connection of electronic devices. TRW, September 5, 1995: US05448014 (124 worldwide citation)

The present invention provides a new and effective method for the sealing and electrical testing of electronic devices; and particularly for surface acoustic wave devices. In accordance with the present invention, the cost and size of making hermetically sealed packages for electronic devices and of ...


7
Eric W Strid, Kimberly R Gleason: Wafer probe. Cascade Microtech, Dellett Smith Hill and Bedell, May 2, 1989: US04827211 (123 worldwide citation)

A wafer probe for accessing bonding pads on a planar device includes contact pads mounted on one edge of the under side of a dielectric substrate board and arranged to align with the bonding pads to be accessed. Coplanar ground and signal conductors deposited on the under side of the substrate board ...


8
Warren K Harwood, Martin J Koxxy, Paul A Tervo: Wafer probe station with integrated environment control enclosure. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, November 30, 1993: US05266889 (119 worldwide citation)

A wafer probe station is equipped with a compact, integrated controlled-environment enclosure providing EMI shielding, substantially hermetic sealing for a dry purge gas for low-temperature testing, and a dark environment. The sealing isolation of the wafer chuck and test probe provided by the enclo ...


9
Simon Costello, Tuyen Paul Pham: Temperature controlled wafer chuck system with low thermal resistance. Trio Tech International, McDermott Will & Emery, August 12, 2003: US06605955 (118 worldwide citation)

A temperature-controlled semiconductor wafer chuck system, the chuck being configured for mounting on a prober stage of a wafer probe test station. The chuck having a top surface and a bottom surface including a heat sink configuration for removal of thermal energy from the chuck. A primary heater c ...


10
Randy J Schwindt, Warren K Harwood, Paul A Tervo: Wafer probe station having full guarding. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, October 10, 1995: US05457398 (111 worldwide citation)

A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting c ...