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Robert Bone, Kirti Vora: Vertical IC chip stack with discrete chip carriers formed from dielectric tape. Hughes Aircraft Company, M E Lachman, M W Sales, W K Denson Low, February 4, 1997: US05600541 (77 worldwide citation)

A 3-D integrated circuit (IC) chip stack employs a plurality of discrete chip carriers that are formed from dielectric tape layers such as fused low temperature cofired ceramic (LTCC) tape. The chips are lodged in cavities within the tape layers, and are either flip-chip or wire bond connected to el ...


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Bone Robert, Vora Kirti: Vertical ic chip stack with discrete chip carriers formed from dielectric tape.. Hughes Aircraft Co, June 21, 1995: EP0658937-A1 (1 worldwide citation)

A 3-D integrated circuit (IC) chip stack employs a plurality of discrete chip carriers (56,58) that are formed from dielectric tape layers such as fused low temperature co-fired ceramic (LTCC) tape. The chips (54) are lodged in cavities within the tape layers, and are either flip-chip or wire bond c ...