1
Bruce J Freyman, Dale Dorinski, John Shurboff: Method of making an ultra high density pad array chip carrier. Motorola, Donald B Southard, Edward M Roney, October 20, 1987: US04700473 (87 worldwide citation)

An ultra high density pad array chip carrier is disclosed which includes a ceramic substrate having a plurality of electrical conductors each of which connect to a respective through-hole plugged with solder on its bottom surface. These solder plugs form a pad array for the chip carrier as well as p ...


2
Bruce J Freyman, Dale Dorinski, John Shurboff: Ultra high density pad array chip carrier. Motorola, Edward M Roney, Donald B Southard, October 13, 1987: US04700276 (64 worldwide citation)

An ultra high density pad array chip carrier is disclosed which includes a ceramic substrate having a plurality of electrical conductors each of which connect to a respective through-hole plugged with solder on its bottom surface. These solder plugs form a pad array for the chip carrier as well as p ...


3
Bruce J Freyman, Barry M Miles, Frank J Juskey: Grounding an ultra high density pad array chip carrier. Motorola, Pablo Meles, December 31, 1991: US05077633 (31 worldwide citation)

A die pad (108) with a punched hole providing a throughway (110) is affixed upon the chip carrier base 100. Such throughway permits the electronic interconnection of the die backside (112) to a conductive runner (104) by electrically conductive material (110) set between the die backside (112) and t ...


4

5
Freyman Bruce J, Miles Barry M, Juskey Frank J: Method of grounding an ultra high density pad array chip carrier. Motorola, PARMELEE Steven G, November 15, 1990: WO/1990/013991

A die pad (108) with a punched hole providing a throughway (110) is affixed upon the chip carrier base (100). Such throughway permits the electronic interconnection of the die backside (112) to a conductive runner (104) by means of electrically conductive material (110) set between the die backside ...


6
Freyman Bruce Joseph, Dorinski Dale, Shurboff John: Ultra high density pad array chip carrier. Motorola, SOUTHARD Donald B, July 16, 1987: WO/1987/004316

An ultra high density pad array chip carrier which includes a ceramic substrate (200) having a plurality of electrical conductors (204, 210) each of which connect to a respective through-hole plugged with solder (206) on its bottom surface. These holder (206) plugs form a pad array for the chip carr ...


7