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Belgacem Haba Belgacem (Bel) Haba
Simon McElrea, Wael Zohni, Belgacem Haba: Through interposer wire bond using low CTE interposer with coarse slot apertures. Tessera, Lerner David Littenberg Krumholz & Mentlik, October 28, 2014: US08872318

A microelectronic package includes a subassembly, a second substrate, and a monolithic encapsulant. The subassembly includes a first substrate that has at least one aperture, a coefficient of thermal expansion (CTE) of eight parts per million per degree Celsius or less, and first and second contacts ...


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THROUGH INTERPOSER WIRE BOND USING LOW CTE INTERPOSER WITH COARSE SLOT APERTURES. TESSERA, February 28, 2013: US20130049196-A1

A microelectronic package includes a subassembly, a second substrate, and a monolithic encapsulant. The subassembly includes a first substrate that has at least one aperture, a coefficient of thermal expansion (CTE) of eight parts per million per degree Celsius or less, and first and second contacts ...