1
David M Geshwind, Anthony H Handal: Method to convert two dimensional motion pictures for three-dimensional systems. May 15, 1990: US04925294 (108 worldwide citation)

The present invention relates to the computer-assisted processing of standard two-dimensional motion pictures to generate processed image sequences which exhibit some three-dimensional depth effects when viewed under appropriate conditions.


2
Wyn K Swainson, Stephen D Kramer: Three-dimensional systems. Formigraphic Engine Corporation, Townsend and Townsend, September 8, 1981: US04288861 (91 worldwide citation)

A multiple beam or "multiphoton" absorption effect is used for creating three-dimensioal sensible objects including optical elements and three-dimensional computer-type data storage and retrieval systems. The objects and systems are made according to the invention by at least two beams of optical el ...


3
Wyn K Swanson, Stephen D Kremer: Three dimensional systems. March 7, 1978: US04078229 (75 worldwide citation)

Method and media are provided for producing three-dimensional sensible objects by the intersection of radiation beams, whereby an active region is produced as a result of the intersection of said beams raising a molecule in the active region to its excited state. Particularly, non-radiation emissive ...


4
Peter D Brewer, Michael G Case, Andrew T Hunter, Mehran Matloubian, John A Roth, Carl W Pobanz: Process for assembling three-dimensional systems on a chip and structure thus obtained. HRL Laboratories, Ladas & Parry, August 7, 2007: US07253091 (62 worldwide citation)

A method for assembling an electronic system with a plurality of layers. Recesses in formed in one or more dielectric layers and electronic components are positioned within the recesses. One or more layers containing the components are placed on a host substrate containing host circuits. Electrical ...


5
William A Reimer: Sliding three dimensional packaging technique. GTE Automatic Electric Laboratories Incorporated, Van Epps Robert F, December 31, 1974: US3858154 (17 worldwide citation)

Apparatus incorporating a novel three-dimensional systems packaging technique facilitating the implementation of direct electrical interconnections between a plurality of printed circuit cards thereby eliminating the routing of electrical signal paths to the card edges. The apparatus basically compr ...


6
Peter G Barthe, Michael H Slayton, Charles D Emery: Reflective ultrasound technology for dermatological treatments. Guided Therapy Systems, Knobbe Martens Olson & Bear, October 31, 2017: US09802063 (6 worldwide citation)

Embodiments of a dermatological cosmetic treatment and imaging system and method can include use of transducer and a reflective surface to simultaneously produce multiple cosmetic treatment zones in tissue. The system can include a hand wand, a removable transducer module, a control module, a graphi ...


7
Zvi Or Bach, Brian Cronquist, Israel Beinglass, J L de Jong, Deepak C Sekar, Paul Lim: Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer. Monolithic 3D, Tran & Associates, July 18, 2017: US09711407 (3 worldwide citation)

A semiconductor device includes a first mono-crystallized layer including first transistors, and a first metal layer forming at least a portion of connections between the first transistors; and a second layer including second transistors, the second transistors including mono-crystalline material, t ...


8
Peter J Zampardi Jr, Hsiang Chih Sun, Hong Shen, Mehran Janani, Jens Albrecht Riege: Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methods. Skyworks Solutions, Knobbe Martens Olson & Bear, September 5, 2017: US09755592 (3 worldwide citation)

One aspect of this disclosure is a power amplifier module that includes a power amplifier configured to amplify a radio frequency (RF) signal and tantalum nitride terminated through wafer via. The power amplifier includes a heterojunction bipolar transistor and a p-type field effect transistor, in w ...


9
Jean Luc Truche, Gregor Overney: Increased depth of field for high resolution imaging for a matrix-based ion source. Agilent Technologies, April 29, 2008: US07365310 (3 worldwide citation)

The invention provides a method of producing an in-focus image of an area on a sample plate for an ion source, e.g., a matrix-based ion source or any other type of ion source that employs a sample plate onto which samples are deposited. The method generally includes: a) positioning an area of the sa ...


10
Dinhphuoc Vu Hoang, Hardik Bhupendra Modi, Hsiang Chih Sun, Peter J Zampardi Jr, Guohao Zhang: Power amplifier modules with bifet and harmonic termination and related systems, devices, and methods. Skyworks Solutions, Knobbe Martens Olson & Bear, June 27, 2017: US09692357 (2 worldwide citation)

One aspect of this disclosure is a power amplifier module that includes a power amplifier die including a power amplifier configured to amplify a radio frequency (RF) signal, the power amplifier including a heterojunction bipolar transistor (HBT) and a p-type field effect transistor (PFET), the PFET ...