1
Hans Fr Schmidt, Siegfried Rauchmaul, Juergen Bednarz: Three-dimensional printed circuit board. Siemens Aktiengesellschaft, Hill Van Santen Steadman & Simpson, April 16, 1991: US05008496 (51 worldwide citation)

A three dimensional printed circuit board having at least two rigid board sections capable of being arranged in different planes and flexibly connected by connecting sections between adjacent board sections is manufactured as a one-piece injection molded part of a thermoplastic molding material. The ...


2
George D Gregoire: Printed circuit board with metallized grooves. Bernard L Kleinke, Jerry R Potts, September 19, 1995: US05451722 (48 worldwide citation)

A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of ...


3
George D Gregoire: Method for making printed circuit boards. Bernard L Kleinke, Jerry R Potts, February 21, 1995: US05390412 (48 worldwide citation)

A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of ...


4
George D Gregoire: Method and apparatus for making printed circuit boards. Bernard L Kleinke, Jerry R Potts, August 2, 1994: US05334279 (47 worldwide citation)

A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of ...


5
Jon Flickinger: Thermoplastic ballast housing in a novel three-dimensional printed circuit board. Pollock Vande Sande & Priddy, May 8, 1990: US04924152 (24 worldwide citation)

The present invention relates to an improved three-dimensional printed circuit board and a plastic housing for power conditioning electronics such as fluorescent lamp ballasts. The novel printed circuit board of the invention is a molded printed circuit board which is generally a rectangular paralle ...


6
Rickey D Akins, John Walvoord, James E Foreman: Conformal photomask for three-dimensional printed circuit board technology. Martin Marietta Corporation, Burns Doane Swecker & Mathis, September 6, 1994: US05344729 (21 worldwide citation)

In a method for fabricating a reusable conformal photomask for a doubly contoured hemispherical substrate such as a radome or a three-dimensional printed circuit board, a light blocking material is deposited on a shell or tool corresponding to the shape of the radome or printed circuit board. A patt ...


7
Adachi Yoshio, Sasaki Sadashi, Kaneko Tamotsu, Harazono Bunichi, Kobayashi Tatsuo: Imaging equipment and assembly method for the imaging equipment. Matsushita Electric, September 7, 2001: JP2001-245186 (17 worldwide citation)

PROBLEM TO BE SOLVED: To realize a structure for imaging equipment, capable of being miniaturized, and light-weight and robust and assembling in quantity, and furthermore obtaining high quality images.SOLUTION: In this imaging equipment, high performance and miniaturization of the equipment are real ...


8
Nishihara Kunio, Hosono Youichi, Nagamine Kunihiro, Kayama Takashi, Ishikawa Takayuki: Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board.. Mitsui Toatsu Chemicals, June 1, 1994: EP0598914-A1 (14 worldwide citation)

A metallic base board is used for mounting electronic components thereon. The board is formed by laminating a plurality of copper foils on a metallic board through thermoplastic polyimide. On the copper foils circuit patterns are formed. The metallic base board having such circuit patterns is bent a ...


9
William V Dumas, Bradley R Karas, Donald F Foust, James W Rose: Method of preparing a photo-mask for imaging three-dimensional objects. General Electric Company, Sudhir G Deshmukh, James C Davis Jr, William H Pittman, August 25, 1992: US05141829 (13 worldwide citation)

A method for the preparation a photo-mask used for photo-imaging selected areas on the surfaces of a three-dimensional printed circuit board substrate. The photo-mask comprises a membrane transparent and degradation resistant to UV light, having at least one side with a contoured shape conforming, a ...


10
James W Rose, Bradley R Karas, Lubomry S Onyshkevych: Technique for preparing a photo-mask for imaging three-dimensional objects. General Electric Company, William H Pittman, January 12, 1993: US05178976 (10 worldwide citation)

A method for the preparation a photo-mask used for photo-imaging selected areas on the surfaces of a three-dimensional printed circuit board substrate. The photo-mask comprises an opaque layer, opaque and degradation resistant to UV light, having at least one side with a contoured shape conforming t ...