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Ka Hing Fung, H Bernhard Pogge: Three-dimensional chip stacking assembly. International Business Machines Corporation, H Daniel Schnurmann, March 12, 2002: US06355501 (386 worldwide citation)

An assembly consisting of three dimensional stacked SOI chips, and a method of forming such integrated circuit assembly, each of the SOI chips including a handler making mechanical contact to a first metallization pattern making electrical contact to a semiconductor device. The metalized pattern, in ...


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Fung Ka Hing, Pogge H Bernhard: Three-dimensional chip stacking assembly. International Business Machines Corporation, December 21, 2002: TW515058 (1 worldwide citation)

An assembly consisting of three dimensional stacked SOI chips, and a method of forming such integrated circuit assembly, each of the SOI chips including a handler making mechanical contact to a first metallization pattern making electrical contact to a semiconductor device. The metalized pattern, in ...


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Fung Ka Hing, Pogge H Bernhard: Three-dimensional chip stacking assembly. International Business Machines Corporation, March 28, 2002: KR1020010057116

PURPOSE: A three-dimensional chip stacking assembly is provided to form a plurality of wafers stacked one on top of the other. CONSTITUTION: An assembly consisting of three dimensional stacked SOI chips, and a method of forming such integrated circuit assembly, each of the SOI chips including a hand ...


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