1
Daniel K Lau, Edward L T Law: Thermal enhanced package for block mold assembly. Advanced Interconnect Technologies, Gregory S Rosenblatt, Wiggin and Dana, August 21, 2007: US07259445 (54 worldwide citation)

A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mo ...


2
Lau Daniel K, Law Edward L T: Thermal enhanced package for block mold assembly. Advanced Interconnect Technologies, Lau Daniel K, Law Edward L T, OLSON Timothy J, April 15, 2004: WO/2004/032186 (2 worldwide citation)

A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mo ...


3
Lau Daniel K, Law Edward L T: Thermal enhanced package for block mold assembly. Advanced Interconnect Tech, July 27, 2005: EP1556894-A2

A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mo ...


4
Daniel K Lau, Edward L T Law: Thermal enhanced package for block mold assembly. Wiggin And Dana, March 22, 2007: US20070065984-A1

A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mo ...


5
Daniel K Lau, Edwrard L T Law: Thermal enhanced package for block mold assembly. Wiggin And Dana, July 27, 2006: US20060166397-A1

A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mol ...


6
Lau Daniel K, Law Edward L T: Thermal enhanced package for block mold assembly. Advanced Interconnect Technolo, guo saiyu, October 19, 2005: CN03823319

A heat spreader ( 20 ) is added to a package to enhance thermal and advantageously electrical performance. In manufacture a heat spreader precursor ( 24 ) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block ...


7
Lau Daniel K, Law Edward L T: Thermal enhanced package for block mold assembly. Advanced Interconnect Technologies, July 7, 2005: KR1020057005389

A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mo ...


8

9

10