1
Keith E Barrett: Test interposer for use with ball grid array packages assemblies and ball grid array packages including same and methods. Micron Technology, Trask Britt, June 27, 2000: US06081429 (95 worldwide citation)

An interposer for evaluating an electrical characteristic of a ball grid array package or of a semiconductor die thereof. The interposer includes electrically conductive vias positioned correspondingly to bond pads of the semiconductor die and to the electrical contacts or terminals of a carrier sub ...


2
Keith E Barrett: Test interposer for use with ball grid array packages, assemblies and ball grid array packages including same, and methods. Micron Technology, TraskBritt, September 17, 2002: US06452807 (34 worldwide citation)

An interposer for evaluating an electrical characteristic of a ball grid array package or of a semiconductor die thereof. The interposer includes electrically conductive vias positioned correspondingly to bond pads of the semiconductor die and to the electrical contacts or terminals of a carrier sub ...



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