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Rick Lake
Rick C Lake, Ross S Dando: Systems and methods for depositing conductive material into openings in microfeature workpieces. Micron Technology, Perkins Coie, December 7, 2010: US07845540

Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir incl ...


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Rick Lake
Lake Rick C, Dando Ross S: Systems and methods for depositing conductive material into openings in microfeature workpieces. Micron Technology, June 19, 2008: KR1020087007211

Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir incl ...


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Lake Rick C, Dando Ross S: Systems and methods for depositing conductive material into openings in microfeature workpieces. Micron Technology, June 18, 2008: EP1931491-A2

Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir incl ...


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Rick C Lake, Ross S Dando: Systems and methods for depositing conductive material into openings in microfeature workpieces. Micron Technology, Perkins Coie, Patent Sea, March 15, 2007: US20070057028-A1

Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir incl ...


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Lake Rick C, Dando Ross S: Systems and methods for depositing conductive material into openings in microfeature workpieces. Micron Technology, Lake Rick C, Dando Ross S, POLEDNA Aaron J, March 8, 2007: WO/2007/027401

Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir incl ...


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