1
Kyu Won Lee, Doo Hyun Park, Dong Hee Kang: Substrate for semiconductor device and manufacturing method thereof. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, March 8, 2011: US07902660 (102 worldwide citation)

A substrate for a semiconductor device and a manufacturing thereof, and a semiconductor device using the same and a manufacturing method thereof are disclosed. For example, in the substrate according to the present invention, a core is eliminated, so that the substrate has a very thin thickness, as ...


2
Kensuke Okonogi, Hiroaki Kikuchi: Laminated substrate for semiconductor device and manufacturing method thereof. NEC Corporation, Sughrue Mion Zinn Macpeak & Seas, December 20, 1994: US05374582 (13 worldwide citation)

A method for fabricating a laminated substrate for a semiconductor device having a high voltage power device and a low voltage element formed in a region isolated from the power device with a P-N junction. The region for the low voltage element is formed on a buried layer of P type formed in the reg ...


3
Ikenaga Chikao, Ikeda Takayuki, Ohashi Naoto, Oda Kazunori, Seki Kentaro: Semiconductor device and manufacturing method thereof, and substrate for semiconductor device and manufacturing method thereof. Dainippon Printing, June 25, 2009: JP2009-141274 (2 worldwide citation)

PROBLEM TO BE SOLVED: To provide a semiconductor device which can be made thin on the whole, is inexpensive and can be easily manufactured and the manufacturing method thereof, and to provide a substrate for the semiconductor device and the manufacturing method thereof.SOLUTION: The semiconductor de ...


4
Takahashi Masanori, Kobayashi Hitoshi: Substrate for semiconductor device and manufacturing method thereof. Fujitsu, October 11, 2002: JP2002-299517 (1 worldwide citation)

PROBLEM TO BE SOLVED: To prevent a bur, which occurs at cutting with a dicing blade, from containing a conductive material, related to a substrate for a semiconductor device.SOLUTION: A wiring pattern and a plated lead wire 26 are formed on a semiconductor device substrate 20 wherein a plurality of ...


5
Monma Akio: Substrate for semiconductor device and manufacturing method thereof. New Japan Radio, October 11, 2002: JP2002-299509 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide a substrate of good productivity for a semiconductor device and a method for manufacturing the semiconductor device, where resin repulsion near the corner of a dam is eliminated.SOLUTION: A substrate for a semiconductor device is provided where a plurality of circuit ...


6
Hirota Masanori, Fuse Mario: Substrate for semiconductor device and manufacturing method thereof. Fuji Xerox, April 28, 1994: JP1994-120508

PURPOSE: To avoid the deposition of an alkaline metal such as Na, etc., contained in a glass substrate in a functional film comprising a FET in the substrate for semiconductor device using a glass substrate. CONSTITUTION: In the substrate for semiconductor device to form a polycrystalline silicon fi ...