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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Apolinar Alvarez Jr: Substrate for a microelectronic package and method of fabricating thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 20, 2010: US07759782 (20 worldwide citation)

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Apolinar Alvarez Jr: Substrate for a microelectronic package and method of fabricating thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 6, 2011: US08071424 (18 worldwide citation)

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Apolinar Alvarez Jr: Substrate for a microelectronic package and method of fabricating thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, April 1, 2014: US08686551

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Apolinar Alvarez: Substrate for a microelectronic package and method of fabricating thereof. Tessera, Tessera, LERNER DAVID et al, October 11, 2007: US20070235856-A1

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Apolinar Alvarez JR: Substrate for a microelectronic package and method of fabricating thereof. Tessera, September 27, 2012: US20120241960-A1

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Apolinar Alvarez JR: Substrate for a microelectronic package and method of fabricating thereof. Tessera, March 8, 2012: US20120056324-A1

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Apolinar Alvarez JR: Substrate for a microelectronic package and method of fabricating thereof. Tessera, Tessera, LERNER DAVID et al, October 28, 2010: US20100273293-A1

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.


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Haba Belgacem, Mitchell Craig S, Alvarez Apolinar: Substrate for a microelectronic package and method of fabricating thereof. Tessera, Haba Belgacem, Mitchell Craig S, Alvarez Apolinar, MILLET Marcus J, November 22, 2007: WO/2007/133350

Substrates (240) having molded dielectric layers (220) and methods of fabricating such substrates are disclosed. The substrates may include pins (210) extending through the molded layer (220) and may include traces (230) connected to the pins. The substrates may advantageously be used in microelectr ...


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Haba Belgacem, Mitchell Craig S, Alvarez Apolinar: Substrate for a microelectronic package and method of fabricating thereof. Tessera, Chen Songtao, May 13, 2009: CN200780015169

The present invention discloses a substrate (240) which comprises a molded dielectric layer (220) and a method for manufacturing the substrate. The substrate can comprise a pin (210) which extends and penetrates the molded layer (220) and can comprise a path line (230) that is connected with the pin ...


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