1
Julian Partridge, James Douglas Wehrly Jr, David Roper: Stacked module systems and method. Staktek Group, Andrews Kurth, J Scott Denko, April 25, 2006: US07033861 (66 worldwide citation)

A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second selected locations on the flex circuitry. The flex circuitry and the combination of the form standard and C ...


2
Julian Partridge, James Douglas Wehrly Jr, David Roper: Stacked module systems and method. Staktek Group, Fish & Richardson P C, January 29, 2008: US07323364 (1 worldwide citation)

A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second selected locations on the flex circuitry. The flex circuitry and the combination of the form standard and C ...


3
Julian Partridge, James Douglas Wehrly, David Roper: Stacked module systems and method. J Scott Denko, November 23, 2006: US20060263938-A1

A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second selected locations on the flex circuitry. The flex circuitry and the combination of the form standard and C ...