1
Belgacem Haba Belgacem (Bel) Haba
Young Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assembly and method therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 1, 2001: US06225688 (230 worldwide citation)

A stacked microelectronic assembly and its resulting structure includes a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The assembly includes a plurality of microelectronic ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Stacked microelectronic assemblies with central contacts. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 13, 2006: US07061121 (82 worldwide citation)

A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one on top of the other with the first microelectronic element underlying at least a portion of the second microelectronic element. The first microelectronic element and the second ...


3
Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assemblies. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 12, 2006: US07149095 (41 worldwide citation)

A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the ...


4
Belgacem Haba Belgacem (Bel) Haba
Kishor Desai, Belgacem Haba, Wael Zohni: Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 19, 2013: US08378478 (39 worldwide citation)

The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelec ...


5
Belgacem Haba Belgacem (Bel) Haba
Moshe Kriman, Osher Avsian, Belgacem Haba, Giles Humpston, Dmitri Burshtyn: Stacked microelectronic assemblies having vias extending through bond pads. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 18, 2013: US08466542 (2 worldwide citation)

A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelec ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp: Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 18, 2013: US08466564

A microelectronic assembly includes a dielectric element having at least one aperture and electrically conductive elements thereon including terminals exposed at the second surface of the dielectric element; a first microelectronic element having a rear surface and a front surface facing the dielect ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp: Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics. Tessera, Lerner David Littenberg Krumholz & Mentlik, October 8, 2013: US08553420

A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front s ...


8
Belgacem Haba Belgacem (Bel) Haba
Vernon Solberg, Pieter H Bellaar, Young Gon Kim, Belgacem Haba: Stacked microelectronic assemblies having basal compliant layers. Tessera, Tessera, LERNER DAVID et al, December 21, 2006: US20060286717-A1

A method of making a stacked microelectronic assembly includes providing a flexible substrate having first and second ends, the flexible substrate having a plurality of attachment sites located between the first and second ends thereof including a first one of the attachment sites located adjacent t ...


9
Belgacem Haba Belgacem (Bel) Haba
Kishor Desai, Belgacem Haba, Wael Zohni: Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts. Tessera Research, May 24, 2012: US20120126389-A1

The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelec ...


10
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Stacked microelectronic assemblies with central contacts. Tessera, Lerner David Litenberg Krumholz & Mentlik, June 2, 2005: US20050116358-A1

A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one on top of the other with the first microelectronic element underlying at least a portion of the second microelectronic element. The first microelectronic element and the second ...



Click the thumbnails below to visualize the patent trend.