1
John C Carson, Robert E DeCaro, Ying Hsu, Michael K Miyake: Stackable modules and multimodular assemblies. Irvine Sensors Corporation, Plante & Strauss, December 23, 1997: US05701233 (142 worldwide citation)

Stacked, multimodular circuit assemblies are provided which comprise stacked, resealable, modules containing electronic circuitry, each module having a plurality of electrically conductive, embedded through-vias between the upper and major surfaces thereof. The through-vias are contained within the ...


2
Carson John C, Decaro Robert E, Hsu Ying: Stackable modules and multimodular assemblies. Irvine Sensors, November 19, 1997: EP0807369-A1

Stacked multimodular circuit assemblies (10, 12, 14) are provided which comprise stacked, sealable, modules containing electronic circuitry (50), each module having a plurality of electrically conductive, embedded through-vias (52, 53) between the upper and lower major surfaces thereof. The through- ...


3
Carson John C, Decaro Robert E, Hsu Ying: Stackable modules and multimodular assemblies. Irvine Sensors Corporation, STRAUSS Robert E, August 1, 1996: WO/1996/023396

Stacked multimodular circuit assemblies (10, 12, 14) are provided which comprise stacked, sealable, modules containing electronic circuitry (50), each module having a plurality of electrically conductive, embedded through-vias (52, 53) between the upper and lower major surfaces thereof. The through- ...