1
Kate E Fey, Charles L Byers, Lee J Mandell: Space-saving packaging of electronic circuits. Alfred E Mann Foundation for Scientific Research, Gary D Schnittgrund, July 4, 2006: US07071546 (257 worldwide citation)

An apparatus and packaging method for stacking a plurality of integrated circuit substrates, i.e., substrates having integrated circuits formed as integral portions of the substrates, which provides interconnection paths through the substrates to simplify electrical connections between the integrate ...


2
Fey Kate E, Byers Chuck L, Mandell Lee J: Space-saving packaging of electronic circuits. Mann Alfred E Found Scient Res, November 3, 2004: EP1472730-A1

An apparatus and packaging method for stacking a plurality of integrated circuit substrates which provides interconnection paths (24,26,28) through the substrates (12) to simplify electrical connections between the integrated circuits (14) while facilitating minimization of the volume and customizat ...


3
Kate E Fey, Charles L Byers, Lee J Mandell: Space-saving packaging of electronic circuits. Alfred E Mann Foundation For, Scientific Research, October 16, 2003: US20030192171-A1

An apparatus and packaging method for stacking a plurality of integrated circuit substrates which provides interconnection paths through the substrates to simplify electrical connections between the integrated circuits while facilitating minimization of the volume and customization of the three dime ...


4
Fey Kate E, Byers Chuck L, Mandell Lee J: Space-saving packaging of electronic circuits. Alfred E Mann Foundation For Scientific Research, Fey Kate E, Byers Chuck L, Mandell Lee J, MANDELL Lee Jay, July 31, 2003: WO/2003/063242

An apparatus and packaging method for stacking a plurality of integrated circuit substrates which provides interconnection paths (24,26,28) through the substrates (12) to simplify electrical connections between the integrated circuits (14) while facilitating minimization of the volume and customizat ...