1
Machio Chihara, Mitsukazu Funahashi: Alkaline developable liquid photoimageable solder resist ink composition. Arakawa Chemical, Pennie & Edmonds, June 12, 1990: US04933259 (14 worldwide citation)

A composition useful as an alkaline developable liquid photoimageable solder resist ink comprising a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and optionally, a thermosetting material as main components wherein the photocurable resin comprises a reaction prod ...


2
Chihara Machio, Funahashi Mitsukazu: Alkaline developable liquid photoimageable solder resist ink composition.. Arakawa Chem, March 8, 1989: EP0306273-A2 (14 worldwide citation)

A composition useful as an alkaline developable liquid photoimageable solder resist ink comprising a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and optionally, a thermosetting material as main components wherein the photocurable resin comprises a reaction prod ...


3
Miyamura Masataka C O Patent D, Wada Yuusuke C O Patent Divisi, Takeda Kazuhiro C O Patent Div, Nakaizumi Yuji C O Patent Divi, Kohara Teiji C O Patent Divisi: Solder resist ink composition.. Tokyo Shibaura Electric Co, July 6, 1988: EP0273729-A2 (13 worldwide citation)

A solder resist ink composition is disclosed which contains a photo-curable resin (A2) obtained by causing an unsaturated monocarboxylic acid to react with a cresolnovolak- or phenolnovolak-type epoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, a ...


4
Masataka Miyamura, Yuusuke Wada, Kazuhiro Takeda, Yuji Nakaizumi, Teiji Kohara: Solder resist ink composition. Kabushiki Kaisha Toshiba, Oblon Spivak McClelland Maier & Neustadt, May 15, 1990: US04925773 (12 worldwide citation)

A solder resist ink composition is disclosed which contains a photo-curable resin obtained by causing an unsaturated monocarboxylic acid to react with a cresolnovolak- or phenolnovolak-type epoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, a phot ...


5
Isamu Tanaka, Hiroshi Kikuchi, Akira Tomizawa, Hitoshi Oka: Epoxy resin composition. Hitachi, Antonelli Terry & Wands, November 26, 1985: US04555532 (10 worldwide citation)

An epoxy resin composition containing as a latent hardener a diaminotriazine-modified imidazole compound and dicyandiamide is improved in the usable life of an solder resist ink composition and can give a solder resist also excellent in resistance to an electroless plating bath.


6
Nouchi Mineo, Morooka Isao, Oba Yoichi, Iwasa Yamahiro: One component type liquid photo solder-resist ink composition. Asahi Chem Res Lab, September 16, 1992: GB2253629-A (8 worldwide citation)

A one component type liquid photo solder-resist ink composition developable with a dilute alkaline solution, which has good resistance to electrolytic corrosion, resistance to gold plating, processing, and productivity, comprises (A) a photo setting resin obtained by causing the reaction product of ...


7
Mizuno Takehisa, Kitazawa Seiichi, Ito Hironobu, Yasuda Tadashi: Photosensitive resin, process for preparation thereof, and solder-resist ink composition. Dainippon Ink &Amp Chem, September 11, 2001: JP2001-247649 (5 worldwide citation)

PROBLEM TO BE SOLVED: To provide a photosensitive resin, a process for preparation thereof and a solder-resist ink composition which are capable of making rapid progress in the sensitivity and the productivity of a laminate and furthermore to improve the tackiness after a preliminary drying.SOLUTION ...


8
Yanagida Nobuyuki: Photosetting/thermosetting matt solder resist ink composition and printed circuit board using it. Taiyo Ink Mfg, February 9, 2006: JP2006-040935 (3 worldwide citation)

PROBLEM TO BE SOLVED: To provide a photosetting/thermosetting matt solder resist ink composition which shows coating property excellent in aging stability, is excellent in heat resistance, chemical resistance and electrical insulation property and can alkaline develop without adherence of a solder p ...


9
Awaji Toshio, Otsuki Nobuaki, Arakawa Motohiro, Tanaka Hiromichi: A solder resist ink composition.. Nippon Catalytic Chem, March 16, 1994: EP0587189-A2 (2 worldwide citation)

The photo-curable liquid solder resist ink composition of the present invention mainly comprises a photo-polymerizable resin having a sufficient molecular weight and (meth)acryloyl groups which are imparted by both the introduction of (meth)acryloyl groups into a novolak-type epoxy resin having 4 or ...


10
Oga Kazuhiko: Solder resist ink composition, solder resist obtained by curing the composition, and manufacturing method of the solder resist. Showa Denko, July 5, 2007: JP2007-171812 (2 worldwide citation)

PROBLEM TO BE SOLVED: To provide a solder resist ink composition that yields no tacks, after an ink has been printed on a substrate and the solvent has evaporated, is excellent in sensitivity to an activation energy line, capable of forming a pattern by development by using a dilute alkaline aqueous ...