1
Richard Francis Frankeny, Jerome Albert Frankeny, Danny Edward Massey, Keith Allan Vanderlee: Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer. International Business Machines Corporation, Casimer K Salys, November 25, 1997: US05691041 (232 worldwide citation)

A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid ...


2
Richard Francis Frankeny, Jerome Albert Frankeny, Danny Edward Massey, Keith Allan Vanderlee: Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer. International Business Machines Corporation, Casimer K Salys, June 23, 1998: US05770891 (52 worldwide citation)

A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid ...