1
Warren M Farnworth, Alan G Wood, Mike Brooks: Semiconductor package including flex circuit, interconnects and dense array external contacts. Micron Technology, Stephen A Gratton, August 1, 2000: US06097087 (294 worldwide citation)

A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in e ...


2
Warren M Farnworth, Alan G Wood, Mike Brooks: Semiconductor package including flex circuit, interconnects and dense array external contacts. Micron Technology, Stephen A Gratton, October 15, 2002: US06465877 (120 worldwide citation)

A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in e ...


3
Warren M Farnworth, Alan G Wood, Mike Brooks: Semiconductor package including flex circuit, interconnects and dense array external contacts. Micron Technology, Stephen A Gratton, May 25, 2004: US06740960 (38 worldwide citation)

A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in e ...


4
Warren M Farnworth, Alan G Wood, Mike Brooks: Semiconductor package including flex circuit, interconnects and dense array external contacts. Stephen A Gratton, The Law Office Of Steve Gratton, July 21, 2005: US20050156297-A1

A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in e ...



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