1
Chi J Song, Gi B Cha: Semiconductor package and method for manufacturing the same. Goldstar Electron, Lowe Price LeBlanc & Becker, August 22, 1995: US05444301 (231 worldwide citation)

A plastic semiconductor package and a method for producing the same. The package comprises a plurality of chip signal transmitting leads protruded from a semiconductor chip and functioning as electrical passage, a plurality of polyimide tapes each attached to the corresponding lead and having the sa ...


2
Su Tao: Semiconductor package and method for manufacturing the same. Advanced Semiconductor Engineering, January 22, 2008: US07321168 (46 worldwide citation)

A semiconductor package comprises a semiconductor chip, a lid, a plurality of traces, a compliant layer, a plurality of conductive pastes, and a plurality of solder pads. The semiconductor chip has an active surface, a backside, and a plurality of bonding pads disposed on the active surface. The lid ...


3
WonSun Shin, DoSung Chun, SeonGoo Lee, SangHo Lee, Vincent DiCaprio: Semiconductor package and method for manufacturing the same. Amkor Technology, Skjerven Morrill, December 31, 2002: US06501184 (34 worldwide citation)

A semiconductor package and method for manufacturing the same is disclosed. The semiconductor package comprises a semiconductor chip, a circuit board, an electrical connection means, an encapsulation material and a plurality of conductive balls. The semiconductor chip has a first surface and a secon ...


4
Lin Wang Yu, Cheng Yi Weng: Package-on-package device, semiconductor package and method for manufacturing the same. Advanced Semiconductor Engineering, November 23, 2010: US07838334 (31 worldwide citation)

A semiconductor package includes a substrate, a chip, an interposer and a molding compound. The chip is electrically connected to the upper surface of the substrate. The interposer is disposed on the chip, and electrically connected to the upper surface of the substrate. The interposer includes an e ...


5
Kyu Jin Lee: Ball grid array package, stacked semiconductor package and method for manufacturing the same. Samsung Electronics, Harness Dickey & Pierce, July 17, 2007: US07245008 (27 worldwide citation)

A BGA package including a substrate, a plurality of solder balls on the semiconductor and an encapsulant, which leaves the solder balls partially exposed on the semiconductor chip, thereby reducing the size of the BGA package. In addition, an edge of the substrate may extend beyond an edge of the se ...


6
Kuo Chung Yee, Chun Chi Lee: Semiconductor package and method for manufacturing the same. Advanced Semiconductor Engineering, Reed Smith, Stanley P Fisher Esq, Juan Carlos A Marquez Esq, October 23, 2007: US07285434 (23 worldwide citation)

A semiconductor package comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an active surface, a back surface opposite to the active surface, an optical component disposed on the active surface, and a plurality ...


7
Chi J Song: Semiconductor package and method for manufacturing the same. Goldstar Electron, Lowe Price LeBlanc & Becker, November 28, 1995: US05471088 (22 worldwide citation)

A semiconductor package having lead bars provided with upper and lower surfaces outwardly exposed, thereby enabling a stacked mounting, a memory extension and a reduction in mounting area.


8
Sung Jin Kim, Sun Jin Son: Printed circuit board for semiconductor package and method for manufacturing the same. Amkor Technology, James E Parsons, Skjerven Morrill, November 5, 2002: US06476331 (22 worldwide citation)

A printed circuit board for a semiconductor package, a semiconductor package, and methods for manufacturing the same are disclosed. One printed circuit board includes a core layer with circuit patterns formed thereon. The circuit patterns do not extend to a periphery of the circuit board. Each circu ...


9
Michikazu Tomita, Tatsuo Suemasu, Sayaka Hirafune: Semiconductor package and method for manufacturing the same. Fujikura, Sughrue Mion Pllc, September 25, 2007: US07274101 (19 worldwide citation)

A semiconductor package includes: a first substrate including: a semiconductor base material having a first side and a second side; a functional element that is provided at the first side of the semiconductor base material; a first wiring; a pad that is electrically connected to the functional eleme ...


10
Jong Sik Paek: Semiconductor package and method for manufacturing the same. Amkor Technology, Stetina Brunda Garred & Brucker, March 2, 2004: US06700187 (17 worldwide citation)

A semiconductor package comprising a semiconductor die having opposed, generally planar first and second surfaces and a peripheral edge. Formed on the second surface of the semiconductor die in close proximity to the peripheral edge thereof are a plurality of bond pads. The semiconductor package fur ...