1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, John W Smith: Method for creating a die shrink insensitive semiconductor package and component therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, October 9, 2001: US06300231 (5 worldwide citation)

A method of connecting a substrate to a semiconductor chip and component therefor to allow for the packaging of a chip even after successive die shrinks. The method compensates for successive die shrinks by providing a substrate that has connection sections of electrical leads that are releasable an ...


2
Belgacem Haba Belgacem (Bel) Haba
Kenneth Allen Honer, Belgacem Haba, David Ovrutsky, Charles Rosenstein, Guilian Gao: Method of forming a wafer level package. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 8, 2011: US08053281 (1 worldwide citation)

A method is provided for forming a microelectronic package at a wafer level. Such method can include providing a semiconductor wafer having a surface with a pattern of electrical contacts thereon. An interposer component can be provided which has a compliant dielectric layer bonded to a conductive l ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, John W Smith: Method for creating a die shrink insensitive semiconductor package and component therefor. Lerner David Littenberg Krumholz & Mentlik, November 29, 2001: US20010046763-A1

A method of connecting a substrate to a semiconductor chip and component therefor to allow for the packaging of a chip even after successive die shrinks. The method compensates for successive die shrinks by providing a substrate that has connection sections of electrical leads that are releasable an ...


4
Belgacem Haba Belgacem (Bel) Haba
Charles White, Belgacem Haba: Microelectronic packages having improved input/output connections and methods therefor. Tessera, Tessera, LERNER DAVID et al, June 26, 2008: US20080150101-A1

A microelectronic assembly includes a microelectronic package, such as a semiconductor package, having a plurality of conductive posts projecting from an exposed surface thereof. The assembly includes a microelectronic element, such as a dielectric film having a first surface and an array of contact ...


5
Belgacem Haba Belgacem (Bel) Haba
Kenneth Allen Honer, Belgacem Haba, David Ovrutsky, Charles Rosenstein, Guilian Gao: Method of forming a wafer level package. Tessera, Tessera, LERNER DAVID et al, June 25, 2009: US20090162975-A1

A method is provided for forming a microelectronic package at a wafer level. Such method can include providing a semiconductor wafer having a surface with a pattern of electrical contacts thereon. An interposer component can be provided which has a compliant dielectric layer bonded to a conductive l ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, John W Smith: Method for creating a die shrink insensitive semiconductor package and component therefor. Tessera, Lerner David Littenberg Krumholz & Mentik, December 3, 2002: US06489674

A method of connecting a substrate to a semiconductor chip and component therefor to allow for the packaging of a chip even after successive die shrinks. The method compensates for successive die shrinks by providing a substrate that has connection sections of electrical leads that are releasable an ...


7
Joseph Fjelstad: Methods for manufacturing a semiconductor package having a sacrificial layer. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 14, 1999: US06001671 (434 worldwide citation)

A method of manufacturing a semiconductor chip package. A sacrificial layer is used as a base to selectively form an array of conductive pads such that a central region is defined by the pads. A back surface of a semiconductor chip is next attached to the sacrificial layer within the central region ...


8
Salman Akram, Alan G Wood, Warren M Farnworth: Method for fabricating stackable chip scale semiconductor package. Micron Technology, Stephen A Gratton, May 22, 2001: US06235554 (388 worldwide citation)

A stackable chip scale semiconductor package and a method for fabricating the package are provided. The package includes a substrate having a die mounting site wherein a semiconductor die is mounted. The package also includes first contacts formed on a first surface of the substrate, and second cont ...


9
Thomas H Dozier II, Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Sockets for electronic components and methods of connecting to electronic components. Form Factor, David J Larwood, Gerald E Linden, June 30, 1998: US05772451 (372 worldwide citation)

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom s ...


10
Seon Goo Lee: Thin, stackable semiconductor packages. Anam Semiconductor, Amkor Technology, October 16, 2001: US06303997 (369 worldwide citation)

A thin, stackable semiconductor package having improved electrical and heat dissipating performance comprises a semiconductor chip having an integrated circuit and a plurality of input/output pads on a surface thereof. A lead frame having a plurality of inner leads with upper and a lower surfaces ha ...