1
Takaaki Higashida, Koichi Kumagai, Takahiro Matsuo: Method of manufacturing a semiconductor element-mounting board. Matsushita Electric Industrial, Wenderoth Lind & Ponack L, May 2, 2006: US07036221 (14 worldwide citation)

A method of manufacturing a semiconductor mounting board includes providing a base member and linear conductive members formed of metallic wires. The conductive members are constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a b ...


2
Masaki Ohno, Masanori Tamaki: Semiconductor mounting board. Ibiden, Oblon Spivak McClelland Maier & Neustadt L, June 15, 2010: US07738258 (7 worldwide citation)

A semiconductor mounting board 80 is prepared by electrically joining an IC chip 70 via an interposer 60 of high rigidity to external pads 41 and internal pads 43, which are formed on the uppermost surface of a build-up layer 30. When the IC chip 70 generates heat, since pads 41 are positioned away ...


3
Ohno Masaki, Tamaki Masanori: Substrate for mounting semiconductor. Ibiden, July 5, 2006: EP1677349-A1 (4 worldwide citation)

A semiconductor mounting board 80 is prepared by electrically joining an IC chip 70 via an interposer 60 of high rigidity to external pads 41 and internal pads 43, which are formed on the uppermost surface of a build-up layer 30. When the IC chip 70 generates heat, since pads 41 are positioned away ...


4
Uchiyama Kenji: Anisotropic electroconductive film, semiconductor mounting board using it, liquid crystal device, and electronic appliance. Seiko Epson, May 12, 2000: JP2000-133330 (2 worldwide citation)

PROBLEM TO BE SOLVED: To provide an anisotropic electroconductive film capable of highly reliable electric connections of terminals formed at a boards or elements, or wirings with each other having different coefficients of thermal expansion. SOLUTION: This anisotropic electroconductive film 22 incl ...


5
Kurashima Yohei: Semiconductor mounting board, its manufacturing method, three-dimensional mounting semiconductor device, its manufacturing method, and electronic apparatus. Seiko Epson, June 2, 2005: JP2005-142210 (2 worldwide citation)

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor mounting board which is capable of surely bonding a joint between the terminal of a semiconductor chip and a board by filling an underfill agent well, and enabling a semiconductor chip to be reduced in size and improved in pe ...


6
Okano Tokuo, Kaneda Aizo, Yasuda Masaaki, Tanji Mika: Semiconductor device, semiconductor mounting board, and manufacture of the semiconductor device. Hitachi Chem, March 14, 2000: JP2000-077457 (1 worldwide citation)

PROBLEM TO BE SOLVED: To enable a manufacturing process to be simplified by a method, wherein the elastic modulus of an insulating layer of a surface material located below the terminal of a printed circuit board connected to the electrode of a semiconductor chip is set within a prescribed range of ...


7
Hozumi Takeshi, Hara Hidetaka, Aoki Hitoshi, Nakamura Kensuke: Semiconductor mounting board and manufacture thereof, and method of mounting semiconductor chip. Sumitomo Bakelite, November 24, 2000: JP2000-323620 (1 worldwide citation)

PROBLEM TO BE SOLVED: To manufacture and provide at low cost a semiconductor mounting board having functions of low electric resistance with a semiconductor chip and high mechanical connection, and further, to obtain a method of mounting semiconductor chip easy in processing and excellent in product ...


8
Ishigame Takeshi: Semiconductor element mounting structure, liquid crystal display thereof and method of mounting semiconductor element of liquid crystal display. Matsushita Electric, December 26, 2001: JP2001-358174 (1 worldwide citation)

PROBLEM TO BE SOLVED: To simplify a method of mounting a semiconductor element, without causing nonconformities such as damage of wiring patterns, even when the semiconductor element is taken out for replacing it.SOLUTION: In the semiconductor element mounting structure of a semiconductor element Dr ...


9
Maeda Nobuhiro, Uchida Kazuya: Method of manufacturing front-to-backside conduction board and method of manufacturing semiconductor mounting board. Hoya, June 12, 2001: JP2001-160678 (1 worldwide citation)

PROBLEM TO BE SOLVED: To provide a method of manufacturing a front-to-backside conduction board which has a high conductivity of conducting parts, a high air sealability, a high position accuracy, a superior smoothness, a superior flatness, and a wide variety of materials usable as an insulator, and ...


10
Ando Takeo: Mounter for semiconductor element, and method of positioning board, using the mounter. Matsushita Electric, September 5, 2003: JP2003-249530 (1 worldwide citation)

PROBLEM TO BE SOLVED: To prevent dislocation in mounting of a semiconductor element which is mounted on a board for mounting a semiconductor element through thermocompression bonding.SOLUTION: In a semiconductor mounter equipped with a movable stage 3 for moving vertically a placed semiconductor mou ...



Click the thumbnails below to visualize the patent trend.