1
Timothy L Jackson, Tim E Murphy: Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof. MicronTechnology, TraskBritt PC, November 8, 2005: US06962867 (435 worldwide citation)

An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes ...


2
Timothy L Jackson, Tim E Murphy: Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies. Micron Technology, TraskBritt, October 5, 2004: US06800930 (425 worldwide citation)

An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes ...