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Shafidul Islam, Daniel K Lau, Romarico S San Antonio, Anang Subagio, Michael H McKerreghan, Edmunda G O Litilit: Semiconductor device package and method for manufacturing same. Unisem, Wiggin and Dana, July 21, 2009: US07563648 (14 worldwide citation)

A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the outer face (58) of the package (50, 102, 110) and another end (68) disposed ...


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Islam Shafidul, Lau Daniel Kwok, San, Antonio Romarico Santos, Subagio Anang, Mckerreghan Michael Hannan, Litilit Edmunda Gut Omen: Semiconductor device package and method for manufacturing same. Advanced Interconnect Technologies, Islam Shafidul, Lau Daniel Kwok, San, Antonio Romarico Santos, Subagio Anang, Mckerreghan Michael Hannan, Litilit Edmunda Gut Omen, OLSON Timothy J, February 24, 2005: WO/2005/017968 (2 worldwide citation)

A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the outer face (58) of the package (50, 102, 110) and another end (68) disposed ...


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Kazutaka Takagi: Radio frequency semiconductor device package and method for manufacturing same, and radio frequency semiconductor device. Kabushiki Kaisha Toshiba, Oblon McClelland Maier & Neustadt L, December 22, 2015: US09219017

A radio frequency semiconductor device package includes a metal base plate, a first metal wall, a second metal wall, and feed-through parts. The first metal wall is provided with first and second openings and connected onto the metal base plate. The openings are set back from a lower surface side an ...


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Islam Shafidul, Lau Daniel Kwok, San Antonio Romarico Santos, Subagio Anang, Mckerreghan Michael Hannan, Litilit Edmunda Gut Omen: Semiconductor device package and method for manufacturing same. Advanced Interconnect Tech, May 10, 2006: EP1654753-A2

A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the outer face (58) of the package (50, 102, 110) and another end (68) disposed ...


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Shafidul Islam, Daniel K Lau, Romarico S San Antonio, Anang Subagio, Michael H McKerreghan, Edmunda G O Litilit: Semiconductor device package and method for manufacturing same. Wiggin And Dana, July 12, 2007: US20070161157-A1

A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the outer face (58) of the package (50, 102, 110) and another end (68) disposed ...


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Islam Shafidul, Lau Daniel K, San Antonio Romarico S, Subagio Anang, Mckerreghan Michael H, Litilit Edmunda G O: Semiconductor device package and method for manufacturing same. Advanced Interconnect Tech, li chunhui, February 25, 2009: CN200480023276

A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the outer face (58) of the package (50, 102, 110) and another end (68) disposed ...


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Lee Moon Chul, Back Kae Dong, Kwon Jong Oh, Wang Qian, Hwang Jun Sik, Jung Kyu Dong: Cap for semiconductor device package and method for manufacturing same. Samsung Electronics, January 11, 2007: JP2007-005787

PROBLEM TO BE SOLVED: To disclose a cap for a semiconductor device package capable of via-hole plating having a seed layer while forming a cavity.SOLUTION: The cap for a semiconductor device package includes a body having a cavity and a predetermined thickness, a first via-hole formed so as to have ...


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Islam Shafidul, Lau Daniel Kwok, San Antonio Romarico Santos, Subagio Anang, Mckerreghan Michael Hannan, Litilit Edmunda Gut Omen: Semiconductor device package and method for manufacturing same. Advanced Interconnect Technologies, May 29, 2006: KR1020067003063

A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the outer face (58) of the package (50, 102, 110) and another end (68) disposed ...


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