1
Ivor Barber: Semiconductor device assembly with minimized bond finger connections. LSI Logic Corporation, Katz & Cotton, August 13, 1996: US05545923 (164 worldwide citation)

A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a conductive layer. The conductive layer is disposed ...


2
Ivor Barber: Semiconductor device assembly with minimized bond finger connections. LSI Logic Corporation, Katz & Cotton, April 21, 1998: US05741726 (17 worldwide citation)

A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a conductive layer. The conductive layer is disposed ...


3
Ivor Barber: Semiconductor device assembly with minimized bond finger connections. LSI Logic Corporation, Katz & Cotton, February 18, 1997: US05604161 (4 worldwide citation)

A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a conductive layer. The conductive layer is disposed ...


4
Ivor Barber: Semiconductor device assembly with minimized bond finger connections. April 20, 1999: US05895968 (4 worldwide citation)

A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a conductive layer. The conductive layer is disposed ...



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