1
David Mosley Garo Khanarian
Garo Khanarian, David Wayne Mosley: Heat stable aryl polysiloxane compositions. Rohm and Haas Company, Jonathan D Baskin, March 27, 2012: US08142895 (2 worldwide citation)

A curable aryl siloxane composition is disclosed. A heat stable cured aryl polysiloxane composition is further disclosed, along with a method of making that heat stable cured aryl polysiloxane composition from the curable aryl siloxane composition. An encapsulated semiconductor device, and a method ...


2
David Mosley Garo Khanarian
David Wayne Mosley, Garo Khanarian: Aryl (thio)ether aryl polysiloxane composition and methods for making and using same. Rohm and Haas Company, Jonathan D Baskin, October 4, 2011: US08029904 (1 worldwide citation)

A curable aryl (thio)ether aryl silicon composition is disclosed. A cured aryl (thio)ether aryl polysiloxane composition is further disclosed, along with a method of making that cured aryl (thio)ether aryl polysiloxane composition from the curable aryl (thio)ether aryl silicon composition. An encaps ...


3
David Mosley Garo Khanarian
Kathleen A Auld, David M Conner, Garo Khanarian, David Wayne Mosley: Phenoxyphenyl polysiloxane composition and method for making and using same. Rohm and Haas Company, Jonathan D Baskin, January 28, 2014: US08637627

A curable phenoxyphenyl polysiloxane composition is disclosed. A cured phenoxyphenyl polysiloxane composition is further disclosed, along with a method of making that cured phenoxyphenyl polysiloxane composition from the curable phenoxyphenyl silicon composition. An encapsulated semiconductor device ...


4
David Mosley Garo Khanarian
David Wayne Mosley, Garo Khanarian: Aryl (thio)ether aryl polysiloxane composition and methods for making and using same. Rohm And Haas Company, July 3, 2008: US20080160323-A1

A curable aryl (thio)ether aryl silicon composition is disclosed. A cured aryl (thio)ether aryl polysiloxane composition is further disclosed, along with a method of making that cured aryl (thio)ether aryl polysiloxane composition from the curable aryl (thio)ether aryl silicon composition. An encaps ...


5
David Mosley Garo Khanarian
Kathleen A Auld, David M Conner, Garo Khanarian, David Wayne Mosley: Phenoxyphenyl polysiloxane composition and method for making and using same. Rohm and Haas Company, Jonathan D Baskin, Rohm and Haas Electronic Materials, June 11, 2009: US20090146324-A1

A curable phenoxyphenyl polysiloxane composition is disclosed. A cured phenoxyphenyl polysiloxane composition is further disclosed, along with a method of making that cured phenoxyphenyl polysiloxane composition from the curable phenoxyphenyl silicon composition. An encapsulated semiconductor device ...


6
David Mosley Garo Khanarian
Garo Khanarian, David Wayne Mosley: Heat stable aryl polysiloxane compositions. Rohm And Haas Company, April 17, 2008: US20080090986-A1

A curable aryl siloxane composition is disclosed. A heat stable cured aryl polysiloxane composition is further disclosed, along with a method of making that heat stable cured aryl polysiloxane composition from the curable aryl siloxane composition. An encapsulated semiconductor device, and a method ...


7
Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Flexible lead structures and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 12, 2000: US06117694 (121 worldwide citation)

A microelectronic component, such as a connector or a packaged semiconductor device is made by connecting multiple leads between a pair of elements and moving the elements away from one another so as to bend the leads toward a vertically extensive disposition. One of the elements includes a temporar ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Giles Humpston, Moti Margalit: Semiconductor packaging process using through silicon vias. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, June 5, 2012: US08193615 (32 worldwide citation)

A microelectronic unit 400 can include a semiconductor element 401 having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts 403 at the front surface and a rear surface remote from the front surface. The semiconductor element 401 can have through holes 41 ...


9
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, March 26, 2013: US08405196 (22 worldwide citation)

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plu ...


10
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kenneth Allen Honer, David B Tuckerman, Vage Oganesian: Chips having rear contacts connected by through vias to front contacts. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, November 13, 2012: US08310036 (19 worldwide citation)

A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plu ...