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Michael Z Su, Gamal Refai Ahmed, Bryan Black: Semiconductor chip with reinforcing through-silicon-vias. Advanced Micro Devices, ATI Technologies ULC, Timothy M Honeycutt, June 5, 2012: US08193039 (11 worldwide citation)

A method of manufacturing includes connecting a first end of a first through-silicon-via to a first die seal proximate a first side of a first semiconductor chip. A second end of the first thu-silicon-via is connected to a second die seal proximate a second side of the first semiconductor chip oppos ...


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Michael Z Su, Gamal Refai Ahmed, Bryan Black: Semiconductor chip with reinforcing through-silicon-vias. Advanced Micro Devices, ATI Technologies ULC, Timothy M Honeycutt, December 25, 2012: US08338961 (9 worldwide citation)

A method of manufacturing includes connecting a first end of a first through-silicon-via to a first die seal proximate a first side of a first semiconductor chip. A second end of the first thu-silicon-via is connected to a second die seal proximate a second side of the first semiconductor chip oppos ...


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Michael Z Su, Gamal Refai Ahmed, Bryan Black: Semiconductor chip with reinforcing through-silicon-vias. August 16, 2012: US20120205791-A1

A method of manufacturing includes connecting a first end of a first through-silicon-via to a first die seal proximate a first side of a first semiconductor chip. A second end of the first thu-silicon-via is connected to a second die seal proximate a second side of the first semiconductor chip oppos ...


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Michael Z Su, Gamal Refai Ahmed, Bryan Black: Semiconductor chip with reinforcing through-silicon-vias. March 29, 2012: US20120074579-A1

A method of manufacturing includes connecting a first end of a first through-silicon-via to a first die seal proximate a first side of a first semiconductor chip. A second end of the first thu-silicon-via is connected to a second die seal proximate a second side of the first semiconductor chip oppos ...


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SU Michael Z, REFAI AHMED Gamal, BLACK Bryan: PUCE À SEMI-CONDUCTEURS POURVU DE TROUS MÉTALLISÉS DE RENFORT TRAVERSANT LE SILICIUM, SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS. Advanced Micro Devices, ATI TECHNOLOGIES ULC, SU Michael Z, REFAI AHMED Gamal, BLACK Bryan, HONEYCUTT Timothy, March 29, 2012: WO/2012/040274

A method of manufacturing includes connecting a first end (131) of a first through-silicon- via (100f) to a first die seal (125) proximate a first side of a first semiconductor chip (15). A second end (133) of the first thu-silicon-via is connected to a second die seal (115) proximate a second side ...


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