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Sun Won Kang: Semiconductor chip package having decoupling capacitor and manufacturing method thereof. Samsung Electronics, Marger Johnson & McCollom P C, October 31, 2006: US07129571 (31 worldwide citation)

A semiconductor chip package has a substrate that includes circuit lines provided on first and/or second surfaces, a power plane provided on the second surface, bump lands provided on the second surface and coupled to the circuit lines, and ball lands provided on the first surface. The package furth ...


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Sun Won Kang: Semiconductor chip package having decoupling capacitor and manufacturing method thereof. Marger Johnson & Mccollom PC, May 19, 2005: US20050104209-A1

A semiconductor chip package has a substrate that includes circuit lines provided on first and/or second surfaces, a power plane provided on the second surface, bump lands provided on the second surface and coupled to the circuit lines, and ball lands provided on the first surface. The package furth ...