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Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Semiconductor chip package with interconnect structure. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 16, 2003: US06664621 (8 worldwide citation)

An active microelectronic element such as a semiconductor chip or wafer is bonded to an interconnect element having substantially the same coefficient of thermal expansion as the active element using small, rigid bonds, desirably made by a solid-phase bonding technique, which accommodate numerous cl ...


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Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Semiconductor chip package with interconnect structure. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 26, 2005: US06921713 (2 worldwide citation)

An active microelectronic element such as a semiconductor chip or wafer is bonded to an interconnect element having substantially the same coefficient of thermal expansion as the active element using small, rigid bonds, desirably made by a solid-phase bonding technique, which accommodate numerous cl ...


3
Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Semiconductor chip package with interconnect structure. Lerner David Littenberg Krumholz & Mentlik, January 3, 2002: US20020000650-A1 (1 worldwide citation)

An active microelectronic element such as a semiconductor chip or wafer is bonded to an interconnect element having substantially the same coefficient of thermal expansion as the active element using small, rigid bonds, desirably made by a solid-phase bonding technique, which accommodate numerous cl ...


4
Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Yukio Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg: Semiconductor chip package assembly and method for making same. Tessera Research, December 13, 2012: US20120313238-A1

A microelectronic assembly may include a substrate containing a dielectric element having first and second opposed surfaces. The dielectric element may include a first dielectric layer adjacent the first surface, and a second dielectric layer disposed between the first dielectric layer and the secon ...


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Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Semiconductor chip package with interconnect structure. Tessera, Lerner David Litenberg Krumholz & Mentlik, April 22, 2004: US20040077129-A1

An active microelectronic element such as a semiconductor chip or wafer is bonded to an interconnect element having substantially the same coefficient of thermal expansion as the active element using small, rigid bonds, desirably made by a solid-phase bonding technique, which accommodate numerous cl ...


6
Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Yukio Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba, Ilyas Mohammed, Philip Damberg: Semiconductor chip package assembly and method for making same. Tessera Research, November 15, 2012: US20120286416-A1

A microelectronic assembly may include a microelectronic element having a plurality of element contacts at a face thereof, and a compliant dielectric element having a Young's modulus of less than about two gigapascal (GPa) and substrate contacts at a first surface joined to the element contacts. The ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Component and assemblies with ends offset downwardly. Tessera, Lerner David Litenberg Krumholz & Mentlik, November 4, 2004: US20040217471-A1

A semiconductor chip package includes a dielectric layer having an attachment portion and an offset portion, off-set downwardly from the attachment portion. A semiconductor chip is mounted to the attachment portion, typically on a bottom or downwardly-facing surface thereof. Terminal structures carr ...


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Joseph Fjelstad: Methods for manufacturing a semiconductor package having a sacrificial layer. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 14, 1999: US06001671 (424 worldwide citation)

A method of manufacturing a semiconductor chip package. A sacrificial layer is used as a base to selectively form an array of conductive pads such that a central region is defined by the pads. A back surface of a semiconductor chip is next attached to the sacrificial layer within the central region ...


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Jerrold L King, Jerry M Brooks: Semiconductor chip package. Micron Technology, Ormiston Korfanta Dunbar & Holland PLLC, October 14, 1997: US05677566 (279 worldwide citation)

A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsulating material to contact the conductive lead ...


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William R Hamburgen, John S Fitch, Yezdi N Dordi: Paddleless molded plastic semiconductor chip package. Digital Equipment Corporation, David A Dagg, Denis G Maloney, Arthur W Fisher, February 18, 1997: US05604376 (222 worldwide citation)

Disclosed is a semiconductor package and method in which a semiconductor chip is mounted within the opening of a lead frame by bonding wires extending between the active front side of the chip and bonding pads of the lead frame, and the lead frame/chip assembly is encased. within a plastic molded bo ...



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