1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Irina Poukhova, Masud Beroz: Selective removal of dielectric materials and plating process using same. Tessera, Lerner David Littenberg Krumholz & Mentlik, January 1, 2002: US06334942 (5 worldwide citation)

A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the me ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Irina Poukhova, Masud Beroz: Selective removal of dielectric materials and plating process using same. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 19, 2008: US07332068

A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the me ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Irina Poukhova, Masud Beroz: Selective removal of dielectric materials and plating process using same. Lerner David Littenberg Krumholz & Mentlik, January 31, 2002: US20020011421-A1

A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the me ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Irina Poukhova, Masud Beroz: Selective removal of dielectric materials and plating process using same. Tessera, Lerner David Litenberg Krumholz & Mentlik, November 4, 2004: US20040217088-A1

A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the me ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Irina Poukhova, Masud Beroz: Selective removal of dielectric materials and plating process using same. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 6, 2004: US06758984

A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the me ...