1
Romarico S San Antonio, Michael H McKerreghan, Anang Subagio, Allan C Toriaga, Lenny Christina Gultom: RF shielding for a singulated laminate semiconductor device package. Unisem, Wiggin and Dana, December 27, 2011: US08084300 (20 worldwide citation)

A method for manufacturing a semiconductor device package to provide RF shielding. The device is mounted on a laminated substrate having conducting pads on its top surface. A molding compound covers the substrate top surface and encapsulates the devices. The substrate is disposed on a tape; the mold ...


2
San Antonio Romarico S, Mckerreghan Michael H, Subagio Anang, Toriaga Allan C, Gultom Lenny Christina: RF shielding for a singulated laminate semiconductor device package. Unisem, shen fazhen, July 4, 2012: CN201110377189

The invention provides a method for manufacturing a semiconductor device package to provide RF shielding. The device is mounted on a laminated substrate having conducting pads on its top surface. A molding compound covers the substrate top surface and encapsulates the devices. The substrate is dispo ...