1
Yuichi Kamayachi, Syoji Inagaki: Resist ink composition. Taiyo Ink Manufacturing, Frost & Jacobs, April 23, 1991: US05009982 (47 worldwide citation)

A photosetting liquid ink composition developable with a dilute alkaline aqueous solution and comprising (A) a resin curable with an activated energy ray, obtained by the reaction of a saturated or unsaturated polybasic acid anhydride with a product of the reaction of a novolak type epoxy compound a ...


2
Soichi Hashimoto, Satoshi Miyayama, Toshiaki Nishimura, Toshikazu Oda: Resist ink composition, printed circuit board produced by using the composition and process for producing the printed circuit board. Goo Chemical, Banner & Allegretti, July 23, 1996: US05539064 (16 worldwide citation)

A resist ink composition developable with a diluted, alkaline solution, which exhibits high dispersion stability itself, can form a pattern with excellent resolution, even in the case of a low exposure amount, and can produce a cured resist film excellent in solvent resistance for high-performance p ...


3
Machio Chihara, Mitsukazu Funahashi: Alkaline developable liquid photoimageable solder resist ink composition. Arakawa Chemical, Pennie & Edmonds, June 12, 1990: US04933259 (14 worldwide citation)

A composition useful as an alkaline developable liquid photoimageable solder resist ink comprising a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and optionally, a thermosetting material as main components wherein the photocurable resin comprises a reaction prod ...


4
Chihara Machio, Funahashi Mitsukazu: Alkaline developable liquid photoimageable solder resist ink composition.. Arakawa Chem, March 8, 1989: EP0306273-A2 (14 worldwide citation)

A composition useful as an alkaline developable liquid photoimageable solder resist ink comprising a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and optionally, a thermosetting material as main components wherein the photocurable resin comprises a reaction prod ...


5
Miyamura Masataka C O Patent D, Wada Yuusuke C O Patent Divisi, Takeda Kazuhiro C O Patent Div, Nakaizumi Yuji C O Patent Divi, Kohara Teiji C O Patent Divisi: Solder resist ink composition.. Tokyo Shibaura Electric Co, July 6, 1988: EP0273729-A2 (13 worldwide citation)

A solder resist ink composition is disclosed which contains a photo-curable resin (A2) obtained by causing an unsaturated monocarboxylic acid to react with a cresolnovolak- or phenolnovolak-type epoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, a ...


6
Masahisa Kakinuma, Shigeru Komori, Kazuhiro Yoshida, Minoru Yokoshima, Tetsuo Ohkubo, Kazunori Sasahara: Resist ink composition and cured article prepared therefrom. Nippon Kayaku Kabushiki Kaisha, Taiyo Ink Manufacturing, Nields & Lemack, July 23, 1996: US05538821 (10 worldwide citation)

The present invention relates to a resist ink composition characterized by comprising a specific unsaturated polycarboxylic acid resin (A) or a specific unsaturated polycarboxylic acid/urethane resin (A'), a photopolymerization initiator (B), a diluent (C), and a curing component (D) and a cured art ...


7
Masataka Miyamura, Yuusuke Wada, Kazuhiro Takeda, Yuji Nakaizumi, Teiji Kohara: Solder resist ink composition. Kabushiki Kaisha Toshiba, Oblon Spivak McClelland Maier & Neustadt, May 15, 1990: US04925773 (10 worldwide citation)

A solder resist ink composition is disclosed which contains a photo-curable resin obtained by causing an unsaturated monocarboxylic acid to react with a cresolnovolak- or phenolnovolak-type epoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, a phot ...


8
Isamu Tanaka, Hiroshi Kikuchi, Akira Tomizawa, Hitoshi Oka: Epoxy resin composition. Hitachi, Antonelli Terry & Wands, November 26, 1985: US04555532 (9 worldwide citation)

An epoxy resin composition containing as a latent hardener a diaminotriazine-modified imidazole compound and dicyandiamide is improved in the usable life of an solder resist ink composition and can give a solder resist also excellent in resistance to an electroless plating bath.


9
Nouchi Mineo, Morooka Isao, Oba Yoichi, Iwasa Yamahiro: One component type liquid photo solder-resist ink composition. Asahi Chem Res Lab, September 16, 1992: GB2253629-A (8 worldwide citation)

A one component type liquid photo solder-resist ink composition developable with a dilute alkaline solution, which has good resistance to electrolytic corrosion, resistance to gold plating, processing, and productivity, comprises (A) a photo setting resin obtained by causing the reaction product of ...


10
Osamu Ogitani, Takashi Shimizu, Ryuichi Fujii, Masao Kawashima, Tuyoshi Kobayashi, Ichiro Akutagawa: Resist ink composition. Somar Corporation, Lorusso & Loud, October 29, 1991: US05061744 (7 worldwide citation)

A resist ink composition suitable for forming a masking pattern resistive against chemical attack by a chemical plating liquor is disclosed which comprises:



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