1
Yoshiharu Takahashi, Jiro Oseto, Teru Hirata: Method of making resin encapsulated semiconductor device with bump electrodes. Mitsubishi Denki Kabushiki Kaisha, Leydig Voit & Mayer, June 16, 1998: US05766972 (183 worldwide citation)

A semiconductor device includes a semiconductor chip attached to a lead frame with recesses on the rear surface of the semiconductor chip opposite the lead frame. These recesses increase the heat radiation area of the semiconductor chip. In a method of producing a semiconductor device, the height of ...


2
Yukio Yamaguchi: Resin encapsulated semiconductor device having a reduced thickness and improved reliability. Matsushita Electronics Corporation, McDermott Will & Emery, June 27, 2000: US06081029 (166 worldwide citation)

A lead frame including signal-connecting leads, a die pad and support leads is provided. A semiconductor chip is bonded to the die pad with an adhesive. The semiconductor chip, electrode pads and the signal-connecting leads are electrically connected to each other with metal fine wires. And these me ...


3
Shinji Baba, Jun Shibata, Tetsuya Ueda: Substrateless resin encapsulated semiconductor device. Mitsubishi Denki Kabushiki Kaisha, Leydig Voit & Mayer, October 19, 1999: US05969426 (164 worldwide citation)

A semiconductor device includes an encapsulating resin encapsulating a semiconductor substrate, a lead pattern or a laminated wiring layers transferred or secured on the lower surface of the encapsulating resin and a plurality of external electrode disposed on the lower surface of the lead pattern. ...


4
Akira Matsushita, Hidekazu Konishi: Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device. Matsushita Electronics Corporation, Ratner & Prestia, December 22, 1992: US05172851 (84 worldwide citation)

A bump electrode having a protrusion is formed. The protrusion is made of a folded wire whose tail is bonded to a cavity on the base of the bump electrode. A method of manufacturing a resin-sealed semiconductor device encapsulating a chip equipped with bump electrodes is also presented.


5
Masanori Minamio, Toru Nomura, Fumihiko Kawai: Resin-encapsulated semiconductor device and method for manufacturing the same. Matsushita Electric Industrial, Donald R Studebaker, Nixon Peabody, March 23, 2004: US06710430 (66 worldwide citation)

A resin-encapsulated semiconductor device includes a die pad, a semiconductor chip mounted on the die pad, and a group of leads. The group of leads include at least three kinds of leads, including first, second and third leads. While the first lead and the third lead are connected to each other upon ...


6
Koji Fujisaki, Akio Nishikawa, Shunichi Numata, Hiroshi Suzuki, Takeshi Komaru, Daisuke Makino: Resin encapsulated semiconductor device. Hitachi, Hitachi Chemical, Antonelli Terry & Wands, July 19, 1988: US04758875 (59 worldwide citation)

Disclosed is a resin encapsulated semiconductor memory device comprising a semiconductor memory element, a package encapsulating the memory element and an .alpha.-rays shielding layer made from a water-resistant aromatic polyimide polymer, interposed between the memory element and the package, the a ...


7
Toshihiro Yasuhara, Masachika Masuda, Gen Murakami, Kunihiko Nishi, Masanori Sakimoto, Ichio Shimizu, Akio Hoshi, Sumio Okada, Tooru Nagamine: Resin-encapsulated semiconductor device having a particular mounting structure. Hitachi, Hitachi Tobu Semiconductor, Antonelli Terry Stout & Kraus, September 22, 1992: US05150193 (58 worldwide citation)

The present invention consists in that a through hole of large area is provided in a die pad or a tab, thereby to prevent a resin from cracking at the rear surface of a surface-packaging resin package in a high-temperature soldering atmosphere of vapor-phase reflow or the like, whereby a resin-molde ...


8
Yasushi Takahashi, Kazuyuki Miyazawa, Hidetoshi Iwai, Masaya Muranaka, Yoshitaka Kinoshita, Satoru Koshiba: Resin-encapsulated semiconductor memory device useful for single in-line packages. Hitachi, Hitachi VLSI Engineering, Antonelli Terry Stout & Kraus, February 15, 1994: US05287000 (55 worldwide citation)

According to one aspect of the present invention, a semiconductor chip, which can be mounted in a zigzag in-line type package (ZIP) partially using a tabless lead frame, includes bonding pads arranged on the chip so that the chip can be applied also to other different types of packages. These differ ...


9
Michihiko Ichinose, Tomoko Takizawa, Hirokazu Honda, Keiichirou Kata: Resin-encapsulated semiconductor device. NEC Electronics Corporation, Young & Thompson, August 26, 2003: US06611063 (46 worldwide citation)

A method for forming a mold-encapsulated semiconductor device includes the steps of mounting a semiconductor chip on a metallic plate having a metallic interconnect pattern thereon, encapsulating the semiconductor chip on the metallic interconnect pattern, removing the bottom of the metallic plate b ...


10
Toshiyuki Fukuda, Masanori Minamio, Hiroaki Fujimoto, Ryuichi Sahara, Kenichi Itou: Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same. Panasonic Corporation, Hamre Schumann Mueller & Larson P C, February 24, 2009: US07495319 (39 worldwide citation)

There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second externa ...