1
Fred Pettinger, Carl White, Dave Marquardt, Sokol Ibrani, Eric Shero, Todd Dunn, Kyle Fondurulia, Mike Halpin: Process feed management for semiconductor substrate processing. ASM America, Snell & Wilmer, April 28, 2015: US09017481 (134 worldwide citation)

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange struc ...


2
Fred Pettinger, Carl White, Dave Marquardt, Sokol Ibrani, Eric Shero, Todd Dunn, Kyle Fondurulia, Mike Halpin: Process feed management for semiconductor substrate processing. ASM America, Snell & Wilmer, February 13, 2018: US09892908

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange struc ...


3
PROCESS FEED MANAGEMENT FOR SEMICONDUCTOR SUBSTRATE PROCESSING. July 2, 2015: US20150187568-A1

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange struc ...


4
PROCESS FEED MANAGEMENT FOR SEMICONDUCTOR SUBSTRATE PROCESSING. May 10, 2018: US20180130652-A1

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange struc ...