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Kazuhiro Yoshikawa, Takashi Kariya: Printed wiring board, method for manufacturing printed wiring board and package-on-package. Ibiden, Oblon McClelland Maier & Neustadt L, June 27, 2017: US09693458 (1 worldwide citation)

A method for manufacturing a printed wiring board includes forming a resin layer on an interlayer layer such that the resin layer has first openings exposing circuits in central portion and second openings exposing circuits in peripheral portion of the interlayer layer, forming solder bumps on the c ...


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Kazuhiro Yoshikawa, Takashi Kariya: Printed wiring board, method for manufacturing printed wiring board, and package-on-package. Ibiden, Oblon McClelland Maier & Neustadt L, February 14, 2017: US09572256

A printed wiring board includes an uppermost insulating layer, first pads positioned to mount an IC chip on the insulating layer, second pads positioned to mount a second printed wiring board on the insulating layer, metal posts formed on the second pads, respectively, such that the metal posts moun ...


3
Kazuhiro Yoshikawa, Takashi Kariya: Printed wiring board, method for manufacturing printed wiring board and package-on-package. Ibiden, Oblon McClelland Maier & Neustadt L, February 21, 2017: US09578745

A method for manufacturing a printed wiring board includes forming a removable layer over first pads in central portion of an interlayer insulation layer to mount IC chip, forming on the interlayer and removable layers a resin insulation layer having openings exposing second pads in peripheral porti ...


4
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND PACKAGE-ON-PACKAGE. Ibiden, September 3, 2015: US20150250054-A1

A printed wiring board includes an uppermost insulating layer, first pads positioned to mount an IC chip on the insulating layer, second pads positioned to mount a second printed wiring board on the insulating layer, metal posts formed on the second pads, respectively, such that the metal posts moun ...


5
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE. Ibiden, April 2, 2015: US20150092357-A1

A method for manufacturing a printed wiring board includes forming a resin insulation layer on an interlayer resin insulation layer and conductive circuits such that the resin insulation layer has first openings exposing pad portions in central portion of the interlayer layer and second openings exp ...


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PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE. Ibiden, April 2, 2015: US20150092356-A1

A method for manufacturing a printed wiring board includes forming a removable layer over first pads in central portion of an interlayer insulation layer to mount IC chip, forming on the interlayer and removable layers a resin insulation layer having openings exposing second pads in peripheral porti ...


7
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE. Ibiden, April 9, 2015: US20150098204-A1

A method for manufacturing a printed wiring board includes forming a resin layer on an interlayer layer such that the resin layer has first openings exposing circuits in central portion and second openings exposing circuits in peripheral portion of the interlayer layer, forming solder bumps on the c ...