1
Katsura Ochi: Pressure-sensitive adhesive sheet structure having relocatable properties. Nippon Carbide Kogyo Kabushiki Kaisha, Sherman & Shalloway, December 3, 1985: US04556595 (99 worldwide citation)

A pressure-sensitive adhesive sheet structure having relocatable properties composed of a pressure-sensitive adhesive layer and non-adhesive solid particles; characterized in that the non-adhesive solid particles having a diameter smaller than the thickness of the adhesive layer and an average diame ...


2
Kyomi Kimimura, Wataru Shimokawa, Toshibumi Igarashi: Dispersion of solvent-suspendible pressure sensitive adhesive particles and pressure sensitive adhesive sheet utilizing the properties of the dispersion. Hoechst Gosei Kabushiki Kaisha, Armstrong Nikaido Marmelstein & Kubovcik, March 3, 1987: US04647504 (73 worldwide citation)

A dispersion of solvent-suspendible pressure sensitive adhesive particles, which comprises (A) pressure sensitive adhesive particles comprising an internally cross-linked copolymer and having a particle size of 5 to 200 microns and an organic solvent; the copolymer being prepared by copolymerizing


3
Arthur L Fry: Repositionable pressure-sensitive adhesive sheet material. Minnesota Mining and Manufacturing Company, Gary L Griswold, Walter N Kirn, Thomas J Odar, March 16, 1993: US05194299 (72 worldwide citation)

Pressure-sensitive adhesive sheet material having the ability to be applied to paper and removed therefrom without lifting fibers or delaminating the paper. The otherwise conventional pressure-sensitive adhesive is applied to the backing by spraying, resulting in a non-repetitive pattern of adhesive ...


4
Aichi Katsuhide, Hasegawa Yuji, Sugiura Minoru, Inada Teiichi, Kawakami Hiroyuki: Pressure-sensitive adhesive sheet for sticking wafer and semiconductor device. Hitachi Chem, August 14, 2002: JP2002-226796 (64 worldwide citation)

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for sticking a wafer which enables to do direct die-bonding and furnishes a semiconductor package with high reliability; and a semiconductor device which can be produced at a low cost and is excellent in temperature-cycle resistanc ...


5
Gregory R Nelson, Horst Georg Zerbe, Cheryl L Moore, Steven M Wick: Transdermal estradiol delivery system. Riker Laboratories, Gary L Griswold, Walter N Kirn, Douglas E Reedich, June 29, 1993: US05223261 (62 worldwide citation)

A pressure-sensitive adhesive sheet material for delivering estradiol to skin, the sheet material comprising a backing with a layer of a pressure-sensitive adhesive adjacent thereto, said pressure-sensitive adhesive layer comprising a pressure-sensitive adhesive polymer, two or more skin penetration ...


6
Silver Spencer F, Winslow Louis E, Zigman Alvin R: Removable pressure-sensitive adhesive sheet material. Minnesota Mining and Manufacturing Company, Alexander Sell Steldt & Delahunt, November 25, 1975: US3922464 (60 worldwide citation)

A flexible self-sustaining backing is coated with a stable viscous copolymer latex formed from monomers of (1) major amounts of certain alkyl acrylates, (2) minor amounts of certain emulsifier monomers, and (3) if desired, minor amounts of zwitterionic monomers, and the water evaporated from the lat ...


7
Leland H Dao: Cauterizer blade wiping device. Devon, Lyon & Lyon, December 5, 1995: US05471705 (48 worldwide citation)

A body, which may have a tubular or dome-like shape with an open top and bottom, has a wall with one or more elongated slots extending along the wall from the top toward the bottom. A cauterizer blade may be drawn through a slot in any suitable orientation to wipe debris from the blade. A mounting, ...


8
Hideo Senoo, Takasi Sugino: Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet. Lintec Corporation, Webb Ziesenheim Bruening Logsdon Orkin & Hanson P C, January 6, 1998: US05705016 (46 worldwide citation)

The present invention disposes an easily releasing layer on a surface intended for dicing tape sticking of a dicing ring frame to thereby enable preventing the transfer of an adhesive substance to the ring frame for use in semiconductor wafer working, reducing the frequency of cleaning of the ring f ...


9
Lindquist Julius A, Buese George J: Conformable adhesive sheet. Johnson & Johnson, May 30, 1972: US3665918 (35 worldwide citation)

This pressure-sensitive adhesive sheet of improved conformability and splitting resistance which may be advantageously employed, for example, as a surgical drape or used in tape form or as part of a surgical bandage comprises a flexible polyurethane foam web which is compressedly set to less than ab ...


10
Toshio Ito, Hiroshi Ninomiya, Kunio Yamagami: Pressure-sensitive adhesive tape or pressure-sensitive adhesive sheet containing nitroglycerin. Nippon Kayaku Kabushiki Kaisha, Taiho Pharmaceutical Company, Nichiban, Oblon Fisher Spivak McClelland & Maier, December 20, 1983: US04421737 (34 worldwide citation)

Pressure-sensitive adhesive tapes or sheets containing nitroglycerin whose release and retention are regulated. Process for the production of pressure-sensitive adhesive tapes or sheets containing nitroglycerin, in which a rubber base adhesives applied on a backing is coated with softeners containin ...