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Tyler A Lowrey: Phase change material memory device. Intel Corporation, Trop Pruner & Hu P C, July 1, 2003: US06586761 (420 worldwide citation)

A phase change material memory cell may be formed with singulated, cup-shaped phase change material. The interior of the cup-shaped phase change material may be filled with a thermal insulating material. As a result, heat losses upwardly through the phase change material may be reduced and adhesion ...


2
Stefan K Lai: Phase change material memory device. Intel Corporation, Trop Pruner & Hu P C, January 28, 2003: US06512241 (402 worldwide citation)

A phase change memory with a very limited area of contact between the lower electrode and the phase change material may be formed by defining a closed geometric structure for the lower electrode. The lower electrode may then be covered. The covering may then be opened in a very narrow strip extendin ...


3
Tyler A Lowrey, Ward D Parkinson, Manzur Gill: Technique and apparatus for performing write operations to a phase change material memory device. Ovonyx, Trop Pruner & Hu P C, April 8, 2003: US06545907 (187 worldwide citation)

A technique includes, in response to a request to write data to memory cells of a phase change memory device, placing the memory cells in a state that is shared in common among the memory cells. Also, in response to this request, the data is written to the memory cells.


4
Stefan K Lai: Phase change material memory device. Intel Corporation, Trop Pruner & Hu P C, April 19, 2005: US06881603 (92 worldwide citation)

A phase change memory with a very limited area of contact between the lower electrode and the phase change material may be formed by defining a closed geometric structure for the lower electrode. The lower electrode may then be covered. The covering may then be opened in a very narrow strip extendin ...


5
Ward D Parkinson, Tyler A Lowrey: Refreshing memory cells of a phase change material memory device. Intel Corporation, Anthony M Martinez, July 27, 2004: US06768665 (53 worldwide citation)

Briefly, in accordance with an embodiment of the invention, an apparatus and method to provide refreshing of a memory cell of a phase change memory device is provided. The method includes determining whether a storage level of a phase change memory cell is within a predetermined margin from a resist ...


6
Stephen S Furkay, Hendrick Hamann, Jeffrey B Johnson, Chung H Lam, Hon Sum P Wong: Phase change memory cell on silicon-on insulator substrate. International Business Machines Corporation, Scully Scott Murphy & Presser, Anthony Canale, February 28, 2006: US07005665 (29 worldwide citation)

The present invention includes a method for forming a phase change material memory device and the phase change memory device produced therefrom. Specifically, the phase change memory device includes a semiconductor structure including a substrate having a first doped region flanked by a set of secon ...


7
Tyler A Lowrey: Phase change material memory device. Intel Corporation, Trop Pruner & Hu P C, June 21, 2005: US06908812 (28 worldwide citation)

A phase change material memory cell may be formed with singulated, cup-shaped phase change material. The interior of the cup-shaped phase change material may be filled with a thermal insulating material. As a result, heat losses upwardly through the phase change material may be reduced and adhesion ...


8
Tyler A Lowrey: Phase change material memory device. Ovonyx, Trop Pruner & Hu P C, January 15, 2008: US07319057 (6 worldwide citation)

A lower electrode may be covered by a protective film to reduce the exposure of the lower electrode to subsequent processing steps or the open environment. As a result, materials that may have advantageous properties as lower electrodes may be utilized despite the fact that they may be sensitive to ...


9
Lowrey Tyler A: Phase change material memory device. Intel Corporation, November 1, 2003: TW559915 (5 worldwide citation)

A phase change material memory cell (10) may be formed with singulated, cup-shaped phase change material (18). The interior of the cup-shaped phase change material (18) may be filled with a thermal insulating material (22). As a result, heat losses upwardly through the phase change material (18) may ...


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