1
Alan G Wood, Tim J Corbett: Packaging for semiconductor logic devices. Micron Technology, Stanley N Protigal, August 11, 1992: US05138434 (217 worldwide citation)

A logic module design is disclosed which incorporates an unencapsulated wafer section or sections. The disclosed module is an improvement over previous designs in that it is less expensive and easier to manufacture due to the reduced number of components and the complexity of the components, is fast ...


2
Alan G Wood, Tim J Corbett: Packaging for semiconductor logic devices. Micron Technology, Fletcher Yoder & Van Someren, December 28, 1999: USRE036469

A logic module design is disclosed which incorporates an unencapsulated wafer section or sections. The disclosed module is an improvement over previous designs in that it is less expensive and easier to manufacture due to the reduced number of components and the complexity of the components, is fast ...