1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Forming microelectronic connection components by electrophoretic deposition. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 10, 2002: US06492201 (84 worldwide citation)

An electrically conductive article such as a sheet having holes therein is coated with a dielectric polymer using a multi-stage electrophoretic deposition process. A coating of uncured polymer is deposited electrophoretically and then cured. After the first polymer is cured, the part is subject to a ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Masud Beroz: Stacked packaging improvements. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 3, 2013: US08525314 (53 worldwide citation)

A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the ...


3
Millicent Chen
Freddie Lee Massey, Deborah Ann Snell Tung, Millicent Louise Martin Shultz, Ben Duh, Charles Louis Kern Jr: Process to prepare a polyester resin. Shell Oil Company, Kim Muller, September 5, 2000: US06113997 (51 worldwide citation)

A process is disclosed to prepare a polyester resin having a predetermined acetaldehyde (AA) content whereby the IV of the melt phase resin is constrained to a certain range resulting in a longer SSP time to achieve a higher level of IV for the resin with an AA content of 1 PPM or less. The resultan ...


4
Belgacem Haba Belgacem (Bel) Haba
Andrey Grinman, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Vage Oganesian: Packaged semiconductor chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 7, 2010: US07791199 (35 worldwide citation)

A chip-sized wafer level packaged device including a portion of a semiconductor wafer including a device, a packaging layer formed over the portion of the semiconductor wafer, the packaging layer including a material having thermal expansion characteristics similar to those of the semiconductor wafe ...


5
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Belgacem Haba, Wael Zohni: De-skewed multi-die packages. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 6, 2013: US08502390 (34 worldwide citation)

A microelectronic package may have a plurality of terminals disposed at a face thereof which are configured for connection to at least one external component. e.g., a circuit panel. First and second microelectronic elements can be affixed with packaging structure therein. A first electrical connecti ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Giles Humpston, Moti Margalit: Semiconductor packaging process using through silicon vias. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, June 5, 2012: US08193615 (30 worldwide citation)

A microelectronic unit 400 can include a semiconductor element 401 having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts 403 at the front surface and a rear surface remote from the front surface. The semiconductor element 401 can have through holes 41 ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Methods of making anisotropic conductive elements for use in microelectronic packaging. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 20, 2001: US06190509 (15 worldwide citation)

A method of making an anisotropic conductive element for use in microelectronic packaging includes providing a layer of an anisotropic conductive material incorporating a dielectric material in a fluid condition and electrically conductive particles in the dielectric material and applying a field to ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Giles Humpston, David Ovrutsky, Laura Mirkarimi: Reconstituted wafer stack packaging with after-applied pad extensions. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 11, 2013: US08461672 (14 worldwide citation)

A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Trac ...


9
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Method of making anisotropic conductive elements for use in microelectronic packaging. Tessera, Lerner David Littenberg Krummholz & Mentlik, February 11, 2003: US06518091 (13 worldwide citation)

A method of making an anisotropic conductive element for use in microelectronic packaging includes providing a layer of material having a pair of oppositely-directed major faces, the layer incorporating a curable dielectric material in a fluid condition and electrically conductive particles in the c ...


10
David Sherrer
David W Sherrer, Mindaugus F Dautargas, Neil Ricks, Dan A Steinberg: Wafer level packaging for optoelectronic devices. Shipley Company L L C, Jonathan D Baskin, March 18, 2008: US07345316 (10 worldwide citation)

An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a li ...