1
David Sherrer
Mindaugas F Dautartas, David W Sherrer, Neal Ricks, Dan A Steinberg: Optical device package for flip-chip mounting. Shipley Company L L C, Jonathan D Baskin, April 26, 2005: US06883977 (7 worldwide citation)

An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive visa extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substr ...


2
David Sherrer
Mindaugas F Dautartas, David W Sherrer, Neal Ricks, Dan A Steinberg: Optical device package for flip-chip mounting. Adrian T Calderone, Dilworth & Barrese, May 22, 2003: US20030095759-A1 (1 worldwide citation)

An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive vias extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substr ...