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Andrew T Hunt, Wen Yi Lin, Richard W Carpenter: Nanolaminated thin film circuitry materials. MicroCoating Technologies, Wayne E Nacker, Alfred H Muratori, Darryl P Frickey, April 3, 2001: US06212078 (56 worldwide citation)

Nanolaminates are formed by alternating deposition, e.g., by combustion chemical vapor deposition (CCVD), layers of resistive material and layers of dielectric material. Outer resistive material layers are patterned to form discrete patches of resistive material. Electrical pathways between opposed ...


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Hunt Andrew T, Lin Wen Yi, Carpenter Richard W: Nanolaminated thin film circuitry materials. Microcoating Technologies, May 2, 2001: EP1096838-A2 (3 worldwide citation)

Nanolaminates are formed by alternating deposition, e.g., by combustion chemical vapor deposition (CCVD), layers of resistive material (11) and layers of dielectric material (12). Outer resistive material layers (11) are patterned to form discrete patches of resistive material. Electrical pathways b ...


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Andrew T Hunt, Wen Yi Lin, Richard W Carpenter: Nanolaminated thin film circuitry materials. Shipley Company, S Matthew Cairns, c o EDWARDS & ANGELL, August 9, 2001: US20010012600-A1

Nanolaminates are formed by alternating deposition, e.g., by combustion chemical vapor deposition (CCVD), layers of resistive material and layers of dielectric material. Outer resistive material layers are patterned to form discrete patches of resistive material. Electrical pathways between opposed ...


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Andrew T Hunt, Wen Yi Lin, Richard W Carpenter: Nanolaminated thin film circuitry materials. October 14, 2003: US06632591

Nanolaminates are formed by alternating deposition, e.g., by combustion chemical vapor deposition (CCVD), layers of resistive material and layers of dielectric material. Outer resistive material layers are patterned to form discrete patches of resistive material. Electrical pathways between opposed ...


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Hunt Andrew T, Lin Wen Yi, Carpenter Richard W: Nanolaminated thin film circuitry materials. Microcoating Technologies, July 1, 2003: TW540262

Nanolaminates are formed by alternating deposition, e.g., by combustion chemical vapor deposition (CCVD), layers of resistive material and layers of dielectric material. Outer resistive material layers are patterned to form discrete patches of resistive material. Electrical pathways between opposed ...


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Carpenter Richard W, Hunt Andrew T, Wen I Rin: Nanolaminated thin film circuitry materials. Micro Coating Technologies, July 12, 2001: KR1020000063292

PURPOSE: Nanolaminated thin film circuitry materials are provided to achieve a nanolaminated structures for forming passive electronic components including capacitors and resistors and to circuitized laminates which provide both capacitors and resistors. In its simplest form. CONSTITUTION: Nanolamin ...


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