11
Junichi Hagihara, Shigekazu Komatsu, Kunihiro Furuya, Tadayoshi Hosaka, Naoki Muramatsu: Maintenance carriage for wafer inspection apparatus and maintenance method for wafer inspection apparatus. Tokyo Electron, NIPPO PRECISION, Pearne & Gordon, June 6, 2017: US09671459

A maintenance carriage of a wafer inspection apparatus can easily unload a test head. A wafer inspection apparatus 10 includes a cell tower 12 in which cells 11 are arranged at four levels, and each of the cells 11 accommodates a test head 15. At an outside of the cell tower 12, a maintenance carria ...


12
January Kister: Multiple contact probes. MicroProbe, March 17, 2011: US20110062978-A1

The present invention is a probe array for testing an electrical device under test comprising one or more ground/power probes and one or more signal probes and optionally a gas flow apparatus.


13
Hamada Shoichi: Method for inspecting nailing on game board and inspection plate. Osaka Seiki, May 15, 2001: JP2001-129175

PROBLEM TO BE SOLVED: To correctly identify the arraying pattern of nails by a simple configuration. SOLUTION: It is inspected whether the multiple nails 2 nailed-down to a game board 1 based on a previously decided reference arraying pattern are correctly nailed-down in accordance with the referenc ...


14
Sakurai Toshio: Device for measuring maximum and minimum value of signal waveform. Sumitomo Metal, September 16, 1994: JP1994-258356

PURPOSE: To measure maximum and minimum values of clock waveform, etc., with no accompanied erroneous recognition of its DC offset, by using a multi- meter. CONSTITUTION: The signal generated by a signal generator 4 is inputted in a device D under test, and then, through a scanner 6 that scans the s ...


15
SUBSTRATE INSPECTION APPARATUS AND PROBE CARD TRANSFERRING METHOD. July 9, 2015: US20150192607-A1

A wafer inspection apparatus 10 includes a middle plate 22 that mounts a probe card 18 in which multiple contact probes 20 are provided; a drawer type table 21 in which the middle plate 22 is provided; a tester 15 to which the probe card 18 is mounted; and a transfer robot 17 that transfers the midd ...


16
MULTIPLE CONTACT PROBES. July 9, 2015: US20150192615-A1

The present invention is a probe array for testing an electrical device under test comprising one or more ground/power probes and one or more signal probes and optionally a gas flow apparatus.


17
WAFER INSPECTION SYSTEM, WAFER INSPECTION APPARATUS AND PROBER. August 17, 2017: US20170234924-A1

A wafer inspection system is provided. The wafer inspection system comprises: a transfer region in which a transfer device is arranged; an inspection region in which test heads for inspecting a substrate are arranged; and a maintenance region in which the test heads are maintained. The inspection re ...


18
SPREAD FORMING DEPOSITION. September 7, 2017: US20170252812-A1

A printer fabricates an object from a build material based on a computerized model and a fused filament fabrication process. A nozzle for depositing the build material has an interior diameter approaching an outer diameter of build material fed to the nozzle in order to reduce extrusion and resistan ...


19
MONITORING TEMPERATURE WITH SEEBECK EFFECT. September 7, 2017: US20170252815-A1

A printer fabricates an object from a computerized model using a fused filament fabrication process and a metallic build material. The Seebeck effect can be employed to monitor a temperature difference between a build material and a nozzle that is extruding the build material based on voltage. The t ...


20
BUILD SURFACES FOR SEMI-SOLID METALLIC ADDITIVE FABRICATION. September 7, 2017: US20170252819-A1

A printer fabricates an object from a computerized model using a fused filament fabrication process and a metallic build material. A build plate that receives the object during fabrication includes a coating of material with a low melt temperature, such as a low melt temperature solder. In particula ...