1
Reiji Higuchi, Shouji Itou, Osamu Nakao: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, Oblon Spivak McClelland Maier & Neustadt P C, July 27, 2004: US06768064 (11 worldwide citation)

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is ...


2
Reiji Higuchi, Shouji Itou, Osamu Nakao: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, Oblon Spivak McClelland Maier & Neustadt P C, December 14, 2004: US06831236 (10 worldwide citation)

A multilayer wiring board assembly, a multilayer wiring board assembly component, and a method of manufacture thereof. The multilayer wiring board assembly is formed by laminating together a plurality of multilayer wiring board assembly components, having a flexible resin film with a copper foil bon ...


3
Reiji Higuchi, Shouji Itou, Osamu Nakao: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, Oblon Spivak McClelland Maier & Neustadt P C, October 17, 2006: US07122746 (5 worldwide citation)

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is ...


4
Reiji Higuchi, Shouji Itou, Osamu Nakao: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, Oblon Spivak McClelland Maier & Neustadt P C, July 5, 2005: US06914200 (4 worldwide citation)

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is ...


5
Reiji Higuchi, Shouji Itou, Osamu Nakao: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, Oblon Spivak McClelland Maier & Neustadt P C, July 5, 2005: US06914199 (2 worldwide citation)

A multilayer wiring board assembly, a multilayer wiring board assembly component, and a method of manufacture thereof. The multilayer wiring board assembly is formed by laminating together a plurality of multilayer wiring board assembly components having a flexible resin film with a copper foil bond ...


6
Higuchi Reiji, Itou Shouji, Nakao Osamu: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, January 1, 2004: TW569653 (1 worldwide citation)

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is ...


7
Higuchi Reiji, Itou Shouji, Nakao Osamu: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, June 11, 2003: TW536926 (1 worldwide citation)

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is ...


8
Reiji Higuchi, Shouji Itou, Osamu Nakao: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, Oblon Spivak Mcclelland Maier & Neustadt PC, October 7, 2004: US20040198053-A1

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is ...


9
Reiji Higuchi, Shouji Itou, Osamu Nakao: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, Oblon Spivak Mcclelland Maier & Neustadt PC, October 7, 2004: US20040195002-A1

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is ...


10
Reiji Higuchi, Shouji Itou, Osamu Nakao: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, Oblon Spivak Mcclelland Maier & Neustadt PC, January 30, 2003: US20030019662-A1

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is ...