1
Seiji Furui, Ryo Maniwa, Kiminori Ishido, Keisuke Okada: Method for producing multilayer printed wiring boards. NEC Corporation, Laff Whitesel Conte & Saret, November 2, 1993: US05258094 (195 worldwide citation)

A multilayered board is formed by applying a photosensitive insulating resin layer on a laminated plate on which via holes and a circuit pattern are formed, followed by the formation of photoviaholes through the photoprinting method, plating and etching. Then, the multilayered board is adhered to an ...


2
Satoshi Isoda, Yasuhiro Iwasaki, Kenshirou Fukuzato, Tsutomu Zama, Koichi Noguchi, Toshiro Okamura, Hiroyoshi Yokoyama, Youiti Matuda: Method of manufacturing multilayer printed wiring board. Hitachi AIC, Blakely Sokoloff Taylor & Zafman, October 27, 1998: US05826330 (105 worldwide citation)

In a method of manufacturing a multilayer printed wiring board including an internal wiring circuit formed on a board, an insulating resin layer formed on the internal wiring circuit, a blind hole formed in the insulating resin layer and communicating with the internal wiring circuit, and a conducti ...


3
Noguchi Satoko, Tezuka Katsumi: Multilayer printed wiring board and manufacturing method of multilayer printed wiring board. Fuji Xerox, December 21, 2001: JP2001-352176 (103 worldwide citation)

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board, which realizes a recycle property, a self-collapse function subsequent to a scrapping of the board and the like and an environmental protection, and to provide the manufacturing method of the multilayer printed wiring board.SOLUTION ...


4
Yasushi Iwane: Multilayer printed wiring board with plurality of ground layers forming separate ground planes. Mitsubishi Denki Kabushiki Kaisha, Rothwell Figg Ernst & Kurz, February 17, 1998: US05719750 (80 worldwide citation)

A printed board 10 is provided with two ground layers 3a, 3b. These ground layers 3a, 3b are electrically insulated inside the printed board. By connecting circuits with different characteristics (low frequency and high frequency, for example) with the different ground layers 3a, 3b, interference of ...


5
Yoshinori Kokubu, Jiro Chiba: Ceramic composition for multilayer printed wiring board. Asahi Glass Company, Oblon Fisher Spivak McClelland & Maier, November 25, 1986: US04624934 (78 worldwide citation)

A ceramic composition for a multilayer printed wiring board, consisting essentially of from 35 to 95% by weight of glass powder and from 5 to 65% by weight of refractory filler powder, said refractory filler powder being at least one member selected from the group consisting of .alpha.-quartz, corun ...


6
Keiji Kurosawa, Kenji Yamamoto, Mirsuo Yamashita, Hisami Mitsui, Ayako Miyabara, Kiyotaka Miyagawa, Takayoshi Imura: Process for manufacturing hollow multilayer printed wiring board. Fujitsu, Staas & Halsey, July 9, 1985: US04528072 (77 worldwide citation)

A hollow multilayer printed wiring board and a process for manufacturing the same are provided. The hollow multilayer printed wiring board is comprised of a plurality of printed substrates, superposed upon each other with a predetermined space therebetween. Each of the substrate has a signal conduct ...


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Kenneth Charles Selk, Harold J Hirsch, James Carl Canyon, Frederick M Gower: Shielded multilayer printed wiring board, high frequency, high isolation. TRW, Michael S Yatsko, October 14, 1997: US05677515 (67 worldwide citation)

A shielded printed wiring board is disclosed which provides electrical and magnetic isolation for the signal layers located thereon. The printed wiring board includes a signal layer laminated between two non-conductive dielectric layers. The bottom side of the printed wiring board has a conductive l ...


9
Shigeo Nakamura, Tadahiko Yokota: Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same. Ajinomoto Co, Oblon Spivak McClelland Maier & Neustadt P C, June 11, 2002: US06403221 (65 worldwide citation)

Epoxy resin compositions which comprise, as essential components, (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing ...


10
Alan W Mast, John W Shipley, Douglas E Heckaman, Walter M Whybrew: Multi title-configured phased array antenna architecture. Harris Corporation, Allen Dyer Doppelt Milbrath & Gilchrist P A, December 26, 2000: US06166705 (64 worldwide citation)

A multi-tile configured, two-dimensional phased array antenna architecture is configured of an gridwork of sub-array `tiles`, each of which contains a mechanically integrated and RF-integrated antenna elements and RF interface components therefor. Each tile is formed of a multilayer printed wiring b ...