1
Charles W Eichelberger: Multichip integrated circuit modules. Integrated System Assemblies, Heslin & Rothenberg, October 5, 1993: US05250843 (494 worldwide citation)

A multichip integrated circuit package comprises a substrate having a flat upper surface to which is affixed one or more integrated circuit chips having interconnection pads. A polymer encapsulant completely surrounds the integrated circuit chips. The encapsulant is provided with a plurality of via ...


2
Hem P Takiar: Multichip integrated circuit module with crossed bonding wires. National Semiconductor Corporation, Hickman Beyer & Weaver, April 29, 1997: US05625235 (23 worldwide citation)

Multichip integrated circuit modules having crossed bonding wires are disclosed together with methods of making the same. The integrated circuit dies of the multi-chip modules are affixed to a suitable die supporting substrate. The dies are then electrically coupled to each other and/or to associate ...