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Warren M Farnworth, Alan G Wood, William M Hiatt, James M Wark, David R Hembree, Kyle K Kirby, Pete A Benson: Multi-dice chip scale semiconductor components and wafer level methods of fabrication. Micron Technology, Stephen A Gratton, January 11, 2005: US06841883 (394 worldwide citation)

A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back side of the bas ...


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Warren M Farnworth, Alan G Wood, William M Hiatt, James M Wark, David R Hembree, Kyle K Kirby, Pete A Benson: Multi-dice chip scale semiconductor components and wafer level methods of fabrication. Stephen A Gratton, The Law Office Of Steve Gratton, December 23, 2004: US20040256734-A1

A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back side of the bas ...