1
Yan John, Du Yong, Symmon Bruce E: Multi-chip module and method of manufacture. Spansion, Yan John, Du Yong, Symmon Bruce E, DRAKE Paul S, November 2, 2006: WO/2006/115649 (5 worldwide citation)

A multi-chip module (10) and a method for manufacturing the multi-chip module (10). A first semiconductor chip (40) is mounted to a support substrate (12) and a second semiconductor chip (50) is mounted to the first semiconductor chip (40). The second semiconductor chip (50) has a smaller dimension ...


2
John Yan, Yong Du, Bruce E Symons: Multi-chip module and method of manufacture. Spansion, Raj Jaipershad, Rennie Wm Dover, January 16, 2007: US07163839 (3 worldwide citation)

A multi-chip module and a method for manufacturing the multi-chip module. A first semiconductor chip is mounted to a support substrate and a second semiconductor chip is mounted to the first semiconductor chip. The second semiconductor chip has a smaller dimension than the first semiconductor chip. ...


3
Yan John, Du Yong, Symmon Bruce E: Multi-chip module and method of manufacture. Spansion, gebo, April 9, 2008: CN200680012623

A multi-chip module (10) and a method for manufacturing the multi-chip module (10). A first semiconductor chip (40) is mounted to a support substrate (12) and a second semiconductor chip (50) is mounted to the first semiconductor chip (40). The second semiconductor chip (50) has a smaller dimension ...


4
Fong Ying Lye, Kee Cheng Sim, Lee Lay Hong, bin Abu Hassan Mohammed Suhaiz: Multi-chip module and method of manufacture. Spansion, gebo, April 30, 2008: CN200680015142

A multi-chip module (10) and a method for manufacturing the multi-chip module (10) that mitigates wire breakage. A first semiconductor chip (40) is mounted and wirebonded to a support substrate (12). A spacer (50) is coupled to the first semiconductor chip (40). A support material (60) is disposed o ...


5
Yan John, Du Yong, Symmon Bruce E: Multi-chip module and method of manufacture. Spansion, January 16, 2008: EP1878048-A2

A multi-chip module (10) and a method for manufacturing the multi-chip module (10). A first semiconductor chip (40) is mounted to a support substrate (12) and a second semiconductor chip (50) is mounted to the first semiconductor chip (40). The second semiconductor chip (50) has a smaller dimension ...


6
Fong Ying Lye, Kee Cheng Sim, Lee Lay Hong, bin Abu Hassan Mohammed Suhaiz: Multi-chip module and method of manufacture. Spansion, January 16, 2008: EP1878049-A2

A multi-chip module (10) and a method for manufacturing the multi-chip module (10) that mitigates wire breakage. A first semiconductor chip (40) is mounted and wirebonded to a support substrate (12). A spacer (50) is coupled to the first semiconductor chip (40). A support material (60) is disposed o ...


7
John Yan, Yong Du, Bruce E Symons: Multi-chip module and method of manufacture. Spansion, Spamsion, C O The Cavanagh Law Firm, November 2, 2006: US20060246704-A1

A multi-chip module and a method for manufacturing the multi-chip module. A first semiconductor chip is mounted to a support substrate and a second semiconductor chip is mounted to the first semiconductor chip. The second semiconductor chip has a smaller dimension than the first semiconductor chip. ...


8
Yin Lye Foong, Cheng Sim Kee, Lay Hong Lee, Mohamed Suhaizal Bin Abu Hassan: Multi-chip module and method of manufacture. Spamsion, C O The Cavanagh Law Firm, November 9, 2006: US20060249826-A1

A multi-chip module and a method for manufacturing the multi-chip module that mitigates wire breakage. A first semiconductor chip is mounted and wirebonded to a support substrate. A spacer is coupled to the first semiconductor chip. A support material is disposed on the spacer and a second semicondu ...


9
Fong Ying Lye, Kee Cheng Sim, Lee Lay Hong, bin, Abu Hassan Mohammed Suhaizal: Multi-chip module and method of manufacture. Spansion, Fong Ying Lye, Kee Cheng Sim, Lee Lay Hong, bin, Abu Hassan Mohammed Suhaizal, JAIPERSHAD Rajendra, November 9, 2006: WO/2006/118994

A multi-chip module (10) and a method for manufacturing the multi-chip module (10) that mitigates wire breakage. A first semiconductor chip (40) is mounted and wirebonded to a support substrate (12). A spacer (50) is coupled to the first semiconductor chip (40). A support material (60) is disposed o ...


10
Fong Ying Lye, Kee Cheng Sim, Lee Lay Hong, bin Abu Hassan Mohammed Suhaizal: Multi-chip module and method of manufacture. Spansion, January 8, 2008: KR1020077025574

A multi-chip module (10) and a method for manufacturing the multi-chip module (10) that mitigates wire breakage. A first semiconductor chip (40) is mounted and wirebonded to a support substrate (12). A spacer (50) is coupled to the first semiconductor chip (40). A support material (60) is disposed o ...